Development of very thin coaxial cable using fluorine resin covered with high adhesion electroless copper plating

开发出采用高附着力化学镀铜覆盖氟树脂的极细同轴电缆

• 批准号: 23656105
• 负责人: YAMAMURA Kazuya
• 金额: $ 2.41万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Challenging Exploratory Research
• 财政年份: 2011
• 资助国家: 日本
• 起止时间: 2011 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-23656105/
• 关键词: 大気圧プラズマ; 無電解めっき; グラフト共重合; ラジカル基; フッ素樹脂; 無電解銅めっき

Recently, a material with a low dielectric constant and low dielectric loss factor in the GHz band is required for coaxial cable and printed circuit boards. Fluorocarbon polymers have excellent high-frequency properties. However, owing to their low surface energy, it is difficult to form highly adhesive metal patterns on their surface. The surface modification of fluorocarbon polymers before metallization is an essential step. We have proposed a surface modification technique for fluorocarbon polymers that enhances the adhesion of electroless copper (Cu) film/fluorocarbon polymers by a combination of atmospheric-pressure plasma treatment with liquid-phase self-assembly. We investigated the adhesion strength of an electroless Cu-plated layer on a tetrafluoroetylene-perfluoroalkylvinylethercopolymer (PFA) surface modified by medium-pressure or atmospheric-pressure plasma. The atmospheric-pressure He plasma treatment resulted in twice the adhesion strength of that obtained by the medium-pressure He plasma treatment. It is considered that a damaged layer is easily formed in the bulk of PFA by medium-pressure He plasma irradiation because a strong IR peak assigned to the CF2 bond was observed from the surface of the electroless Cu film by FTIR analysis after a 90° peel test.

近年来，同轴电缆和印制电路板对低介电常数、低介质损耗因子的材料提出了更高的要求。氟碳聚合物具有优异的高频性能。然而，由于它们的表面能很低，很难在其表面形成高度粘合的金属图案。对氟碳聚合物进行金属化前的表面改性是必不可少的一步。我们提出了一种氟碳聚合物的表面改性技术，通过常压等离子体处理和液相自组装相结合的方法来提高化学镀铜膜/氟碳聚合物的附着力。研究了中压或常压等离子体对聚偏氟乙烯(tetrafluoroetylene-perfluoroalkylvinylethercopolymer)表面化学镀铜层结合强度的影响。常压氦等离子体处理的粘接强度是中压氦等离子体处理的两倍。经90°剥离试验后，FTIR分析表明，化学镀铜膜表面有一个很强的CF2键红外谱峰，因此中压He等离子体辐照容易在PFA的块体中形成一层损伤层。

项目成果

Study on Adhesion Strength of Cu Plating Film Formed on PTFE Substrate through Atmospheric Pressure Plasma Liquid Deposition

常压等离子体液体沉积聚四氟乙烯基材上镀铜膜附着力研究

• 发表时间: 2011
• 作者: Y. Hara;K. Oooka;H. Akiyama;N. Zettsu;K. Yamamura
• 通讯作者: K. Yamamura

Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma

• DOI: 10.4028/www.scientific.net/kem.523-524.262
• 发表时间: 2012-11
• 期刊: Key Engineering Materials
• 作者: Kento Ooka;Y. Yamamoto;Y. Hara;N. Zettsu;K. Yamamura

Interfacial Analysis of Electroless Copper Thin Film on Fluorocarbon Polymer Fabricated by Plasma Irradiation with Graft Copolymerization

等离子体辐照接枝共聚制备氟碳聚合物化学镀铜薄膜的界面分析

• 发表时间: 2012
• 作者: K. Ooka;Y. Hara;K. Yamamura
• 通讯作者: K. Yamamura

大気圧プラズマ化学液相堆積法によるフッ素ポリマー表面への高密着性金属配線パターン作製

使用大气压等离子体化学液相沉积在含氟聚合物表面上制造高粘合性金属布线图案

• 发表时间: 2011
• 作者: 大岡健人;秋山弘貴;山本悠人;原 安寛;山村和也;是津信行
• 通讯作者: 是津信行

プラズマ化学液相堆積法によるフッ素ポリマー表面の銅メタライジングー電解銅めっき膜の密着強度におけるプラズマ発生圧力依存性－

通过等离子体化学液相沉积法在含氟聚合物表面进行铜金属化 - 等离子体产生压力对电解铜镀膜附着强度的依赖性 -

• 发表时间: 2012
• 作者: 大岡健人;山本悠人;是津信行;山村和也
• 通讯作者: 山村和也