Development of very thin coaxial cable using fluorine resin covered with high adhesion electroless copper plating

开发出采用高附着力化学镀铜覆盖氟树脂的极细同轴电缆

• 批准号: 23656105
• 负责人: YAMAMURA Kazuya
• 金额: $ 2.41万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Challenging Exploratory Research
• 财政年份: 2011
• 资助国家: 日本
• 起止时间: 2011 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-23656105/
• 关键词: 大気圧プラズマ; 無電解めっき; グラフト共重合; ラジカル基; フッ素樹脂; 無電解銅めっき

Recently, a material with a low dielectric constant and low dielectric loss factor in the GHz band is required for coaxial cable and printed circuit boards. Fluorocarbon polymers have excellent high-frequency properties. However, owing to their low surface energy, it is difficult to form highly adhesive metal patterns on their surface. The surface modification of fluorocarbon polymers before metallization is an essential step. We have proposed a surface modification technique for fluorocarbon polymers that enhances the adhesion of electroless copper (Cu) film/fluorocarbon polymers by a combination of atmospheric-pressure plasma treatment with liquid-phase self-assembly. We investigated the adhesion strength of an electroless Cu-plated layer on a tetrafluoroetylene-perfluoroalkylvinylethercopolymer (PFA) surface modified by medium-pressure or atmospheric-pressure plasma. The atmospheric-pressure He plasma treatment resulted in twice the adhesion strength of that obtained by the medium-pressure He plasma treatment. It is considered that a damaged layer is easily formed in the bulk of PFA by medium-pressure He plasma irradiation because a strong IR peak assigned to the CF2 bond was observed from the surface of the electroless Cu film by FTIR analysis after a 90° peel test.

近来，同轴电缆和印刷电路板需要在GHz频带中具有低介电常数和低介电损耗因子的材料。氟碳聚合物具有优异的高频性能。然而，由于它们的低表面能，很难在它们的表面上形成高粘附性的金属图案。氟碳聚合物在金属化前的表面改性是必不可少的步骤。我们已经提出了一种氟碳聚合物的表面改性技术，通过大气压等离子体处理与液相自组装相结合来增强化学镀铜（Cu）膜/氟碳聚合物的粘附力。本文研究了在中压或常压等离子体改性的四氟乙烯-全氟烷基乙烯基醚共聚物（PFA）表面化学镀铜层的结合强度。大气压He等离子体处理导致通过中压He等离子体处理获得的粘附强度的两倍。通过90°剥离试验后的FTIR分析，从化学镀铜膜表面观察到一个强的红外峰，归属于CF 2键，因此认为中压He等离子体辐照易在PFA基体中形成损伤层。

项目成果

Study on Adhesion Strength of Cu Plating Film Formed on PTFE Substrate through Atmospheric Pressure Plasma Liquid Deposition

常压等离子体液体沉积聚四氟乙烯基材上镀铜膜附着力研究

• 发表时间: 2011
• 作者: Y. Hara;K. Oooka;H. Akiyama;N. Zettsu;K. Yamamura
• 通讯作者: K. Yamamura

Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma

• DOI: 10.4028/www.scientific.net/kem.523-524.262
• 发表时间: 2012-11
• 期刊: Key Engineering Materials
• 作者: Kento Ooka;Y. Yamamoto;Y. Hara;N. Zettsu;K. Yamamura

Interfacial Analysis of Electroless Copper Thin Film on Fluorocarbon Polymer Fabricated by Plasma Irradiation with Graft Copolymerization

等离子体辐照接枝共聚制备氟碳聚合物化学镀铜薄膜的界面分析

• 发表时间: 2012
• 作者: K. Ooka;Y. Hara;K. Yamamura
• 通讯作者: K. Yamamura

大気圧プラズマ化学液相堆積法によるフッ素ポリマー表面への高密着性金属配線パターン作製

使用大气压等离子体化学液相沉积在含氟聚合物表面上制造高粘合性金属布线图案

• 发表时间: 2011
• 作者: 大岡健人;秋山弘貴;山本悠人;原 安寛;山村和也;是津信行
• 通讯作者: 是津信行

プラズマ化学液相堆積法によるフッ素ポリマー表面の銅メタライジングー電解銅めっき膜の密着強度におけるプラズマ発生圧力依存性－

通过等离子体化学液相沉积法在含氟聚合物表面进行铜金属化 - 等离子体产生压力对电解铜镀膜附着强度的依赖性 -

• 发表时间: 2012
• 作者: 大岡健人;山本悠人;是津信行;山村和也
• 通讯作者: 山村和也