Polymer colour matching devices (POCOMAT)

有机TFT已经被开发用于柔性塑料基板上的广泛的显示器和集成电路应用。对于显示器应用，有机TFT已经达到工业化的高级阶段。我们的工业合作伙伴Plastic Logic在塑料基板上制造柔性显示器，该显示器由超过100万个OTFT组成，适用于轻巧、坚固的电子阅读器。与显示器相比，OTFT的电路应用更难实现。这主要是由于印刷的OTFT的差的切换性能，其由于有机半导体的相对低的迁移率（尽管近年来有显著的改进，但其仍然“仅”在lcm 2/Vs的量级上）和基于印刷技术的普通图形艺术的低分辨率而产生。我们克服印刷电子器件的关键性能问题的方法是开发用于OTFT的基于高分辨率印刷的制造工艺（自对准印刷（SAP）/自对准栅极（SAG）技术）（Noh等人，Nature Nanotechnology 2，784（2007）），其允许通过简单的喷墨印刷技术制造具有亚微米沟道长度和低寄生栅极电容的TFT。在EPSRC/CIKC资助的PRIME项目中，我们将该技术开发成一种受控的技术平台，用于制造通常具有100个TFT的集成电路。TFT的数量受到我们大学制造和测试基础设施的限制。PRIME项目有两个主要的技术目标：（a）建立先前开发的用于缩小印刷有机TFT的SAP/SAG工艺的可制造性，以及（B）将p型和n型有机半导体集成到这种缩小的印刷TFT中，以允许制造高产量、低功率的印刷CMOS电路。拟议的后续资助项目的目标是在特定的集成电路应用中将该技术平台商业化，该应用与我们目前的制造基础设施（约100个元件）可以实际实现的有限集成水平兼容。

Organic TFTs have been developed for a broad range of display and integrated circuit applications on flexible, plastic substrates. For display applications organic TFTs have reached an advanced stage of industrialisation. Our industrial partner, Plastic Logic, manufactures flexible displays comprising more than 1 million OTFTs on a plastic substrate for applications in lightweight, robust electronic readers. In contrast to displays circuit applications of OTFTs have been much harder to realize. This is mainly due to the poor switching performance of printed OTFTs arising as a consequence of the relatively low mobility of organic semiconductors (which in spite of dramatic improvements in recent years is still "only" on the order of 1 cm2/Vs) and the low resolution of common graphic arts based printing techniques. Our approach to overcome the critical performance issues of printed electronics has been to develop a high-resolution printing-based manufacturing process for OTFTs (self aligned printing (SAP) / self-aligned gate (SAG) technology) (Noh et al., Nature Nanotechnology 2, 784 (2007)), which allows fabrication of TFTs with submicrometer channel lengths and low parasitic gate capacitance by simple inkjet printing techniques. In the EPSRC/CIKC funded PRIME project we developed this technology into a controlled technology platform for fabrication of integrated circuits with typically 100 TFTs. The number of TFTs is limited by our university fabrication and testing infrastructure. The PRIME project had two main technological objectives: (a) to establish manufacturability of the previously developed SAP/SAG process for downscaling printed organic TFTs and (b) to integrate both p-type and n-type organic semiconductors into such downscaled, printed TFTs to allow fabrication of high yielding, low power printed CMOS circuits. The objective of the proposed follow-on funding project is to commercialize this technology platform in a specific integrated circuit application that is compatible with the limited integration level that we can realistically achieve with our current fabrication infrastructure (about 100 elements).