FLEXIBLE ELECTRONIC DEVICE MODELLING
灵活的电子设备建模
基本信息
- 批准号:EP/M002519/1
- 负责人:
- 金额:$ 12.48万
- 依托单位:
- 依托单位国家:英国
- 项目类别:Research Grant
- 财政年份:2014
- 资助国家:英国
- 起止时间:2014 至 无数据
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Largely driven by material scientists, the flexible electronic research thus far has focussed on the materials and fabrication techniques. Whilst these are important areas, device modelling and circuit design is critical for taking the research closer to manufacturing. The acceptable degree of bendability for reliable operation of devices and circuits is a question that has not been addressed so far. This is a challenging because the standard transistor models for circuit simulation programs such as SPICE do not take into account the dynamic bendability induced effects. FLEXELDEMO will address these challenges by systematically characterizing the ultra-thin chips, identifying various parameters that change with bending, and suggesting improved BSIM models for devices over bendable substrates. This project has several anticipated benefits over a range of time-scales. In the short-term, this project will substantially improve our understanding of changes in various device parameters as a result of bending (uni-axial, bi-axial or twisting etc.), which has traditionally been under-studied. In the medium-term, it will enable designing of electronics on bendable substrate and predicting the behaviour of bendable electronics just like we do currently for planar electronics. In the long-term, the project will lead to intelligent use of bendability in improving circuit design. For example, location or shape dependent strain-field variations will be used to design location-/shape-aware circuits or to compensate electronic artefacts (e.g. self-calibration). The approach could also lead to design on bendable electronics based on ensemble of nanowires. Formulating the design rules and integration strategies through modelling will help in stabilizing the nascent flexible electronics technology. By adequately supporting the fabrication activities with modelling and simulation, this project will add significant new perspective to the fields of flexible electronics and electronics design.
在材料科学家的推动下,柔性电子的研究主要集中在材料和制造技术上。虽然这些都是重要的领域,但器件建模和电路设计对于使研究更接近制造至关重要。对于器件和电路的可靠操作来说,可接受的可弯曲程度是迄今为止尚未解决的问题。这是一个挑战,因为电路模拟程序,如SPICE的标准晶体管模型不考虑动态弯曲诱导效应。FLEXELDEMO将通过系统地表征超薄芯片,识别随弯曲而变化的各种参数,并为可弯曲衬底上的器件提出改进的BSIM模型来解决这些挑战。该项目在一系列时间范围内具有若干预期效益。在短期内,该项目将大大提高我们对弯曲(单轴、双轴或扭转等)导致的各种器械参数变化的理解,这在传统上一直被忽视。从中期来看,它将能够在可弯曲基板上设计电子器件,并预测可弯曲电子器件的行为,就像我们目前对平面电子器件所做的那样。从长远来看,该项目将导致在改进电路设计中智能地使用可弯曲性。例如,位置或形状相关的应变场变化将用于设计位置/形状感知电路或补偿电子伪影(例如自校准)。这种方法还可以导致基于纳米线集合的可弯曲电子产品的设计。通过建模制定设计规则和集成策略将有助于稳定新兴的柔性电子技术。通过建模和仿真充分支持制造活动,该项目将为柔性电子和电子设计领域增添重要的新视角。
项目成果
期刊论文数量(10)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Device modelling of silicon based high-performance flexible electronics
硅基高性能柔性电子器件的器件建模
- DOI:10.1109/isie.2017.8001578
- 发表时间:2017
- 期刊:
- 影响因子:0
- 作者:Gupta S
- 通讯作者:Gupta S
Large area electronic skin
大面积电子皮肤
- DOI:10.1109/icsens.2016.7808420
- 发表时间:2016
- 期刊:
- 影响因子:0
- 作者:Dahiya R
- 通讯作者:Dahiya R
Device Modelling for Bendable Piezoelectric FET-Based Touch Sensing System
- DOI:10.1109/tcsi.2016.2615108
- 发表时间:2016-12-01
- 期刊:
- 影响因子:5.1
- 作者:Gupta, Shoubhik;Heidari, Hadi;Dahiya, Ravinder
- 通讯作者:Dahiya, Ravinder
PDMS residues-free micro/macrostructures on flexible substrates
- DOI:10.1016/j.mee.2015.04.037
- 发表时间:2015-03-25
- 期刊:
- 影响因子:2.3
- 作者:Dahiya, Ravinder;Gottardi, Gloria;Laidani, Nadhira
- 通讯作者:Laidani, Nadhira
CMOS Vertical Hall Magnetic Sensors on Flexible Substrate
- DOI:10.1109/jsen.2016.2575802
- 发表时间:2016-12-15
- 期刊:
- 影响因子:4.3
- 作者:Heidari, Hadi;Bonizzoni, Edoardo;Dahiya, Ravinder
- 通讯作者:Dahiya, Ravinder
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Ravinder Dahiya其他文献
Intelligent machines work in unstructured environments by differential neuromorphic computing
智能机器通过差分神经形态计算在非结构化环境中工作
- DOI:
- 发表时间:
2023 - 期刊:
- 影响因子:0
- 作者:
Shengbo Wang;Shuo Gao;Chenyu Tang;Edoardo Occhipinti;Cong Li;Shurui Wang;Jiaqi Wang;Hubin Zhao;Guohua Hu;A. Nathan;Ravinder Dahiya;L. Occhipinti - 通讯作者:
L. Occhipinti
End-of-Life usefulness of degradation by products from transient electronics
瞬态电子产品降解副产品的报废期有用性
- DOI:
10.1038/s41528-025-00411-w - 发表时间:
2025-05-07 - 期刊:
- 影响因子:15.500
- 作者:
Sofia Sandhu;Ravinder Dahiya - 通讯作者:
Ravinder Dahiya
Ultra-thin chips for high-performance flexible electronics
用于高性能柔性电子设备的超薄芯片
- DOI:
10.1038/s41528-018-0021-5 - 发表时间:
2018-03-14 - 期刊:
- 影响因子:15.500
- 作者:
Shoubhik Gupta;William Taube Navaraj;Leandro Lorenzelli;Ravinder Dahiya - 通讯作者:
Ravinder Dahiya
Fully degradable, transparent, and flexible photodetectors using ZnO nanowires and PEDOT:PSS based nanofibres
基于 ZnO 纳米线和 PEDOT:PSS 纳米纤维的完全可降解、透明且灵活的光电探测器
- DOI:
10.1038/s41528-025-00385-9 - 发表时间:
2025-03-10 - 期刊:
- 影响因子:15.500
- 作者:
Xenofon Karagiorgis;Nitheesh M. Nair;Sofia Sandhu;Abhishek Singh Dahiya;Peter J. Skabara;Ravinder Dahiya - 通讯作者:
Ravinder Dahiya
Energy autonomous electronic skin
能量自主电子皮肤
- DOI:
10.1038/s41528-018-0045-x - 发表时间:
2019-01-04 - 期刊:
- 影响因子:15.500
- 作者:
Carlos García Núñez;Libu Manjakkal;Ravinder Dahiya - 通讯作者:
Ravinder Dahiya
Ravinder Dahiya的其他文献
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{{ truncateString('Ravinder Dahiya', 18)}}的其他基金
EAGER: Flexible and compressible e-Skin integrated with soft magnetic coil based ultra-thin actuator and touch sensor for robotics applications
EAGER:灵活且可压缩的电子皮肤与基于软磁线圈的超薄执行器和触摸传感器集成,适用于机器人应用
- 批准号:
2337074 - 财政年份:2023
- 资助金额:
$ 12.48万 - 项目类别:
Standard Grant
Engineering Fellowship for Growth - Neuromorphic Printed Tactile Skin (NeuPRINTSKIN) (Ext)
成长工程奖学金 - 神经形态印刷触觉皮肤 (NeuPRINTSKIN)(扩展)
- 批准号:
EP/R029644/1 - 财政年份:2018
- 资助金额:
$ 12.48万 - 项目类别:
Fellowship
Engineering Fellowships for Growth: Printable Tactile Skin
增长工程奖学金:可打印的触觉皮肤
- 批准号:
EP/M002527/1 - 财政年份:2014
- 资助金额:
$ 12.48万 - 项目类别:
Fellowship
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