Parallel Heterogeneous Integration of III-V Devices on Silicon Photonic Chips

硅光子芯片上 III-V 族器件的并行异构集成

基本信息

  • 批准号:
    EP/P013597/1
  • 负责人:
  • 金额:
    $ 41.19万
  • 依托单位:
  • 依托单位国家:
    英国
  • 项目类别:
    Research Grant
  • 财政年份:
    2017
  • 资助国家:
    英国
  • 起止时间:
    2017 至 无数据
  • 项目状态:
    已结题

项目摘要

Abstracts are not currently available in GtR for all funded research. This is normally because the abstract was not required at the time of proposal submission, but may be because it included sensitive information such as personal details.
目前GtR中并没有所有资助研究的摘要。这通常是因为在提交提案时不需要摘要,但也可能是因为摘要中包含个人详细信息等敏感信息。

项目成果

期刊论文数量(10)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Thin film diamond membranes bonded on-demand with SOI ring resonators
  • DOI:
    10.1016/j.diamond.2018.07.020
  • 发表时间:
    2018-09-01
  • 期刊:
  • 影响因子:
    4.1
  • 作者:
    Hill, Paul;Gu, Erdan;Strain, Michael J.
  • 通讯作者:
    Strain, Michael J.
All-optical tuning of a diamond micro-disk resonator on silicon
硅上金刚石微盘谐振器的全光学调谐
  • DOI:
    10.1364/prj.372358
  • 发表时间:
    2020
  • 期刊:
  • 影响因子:
    7.6
  • 作者:
    Hill P
  • 通讯作者:
    Hill P
Nanoscale transfer printing for heterogeneous device integration (Conference Presentation)
用于异构设备集成的纳米级转移打印(会议演示)
  • DOI:
    10.1117/12.2254260
  • 发表时间:
    2017
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Hurtado A
  • 通讯作者:
    Hurtado A
Characterization, Selection, and Microassembly of Nanowire Laser Systems
  • DOI:
    10.1021/acs.nanolett.9b05078
  • 发表时间:
    2020-03-11
  • 期刊:
  • 影响因子:
    10.8
  • 作者:
    Jevtics, Dimitars;McPhillimy, John;Strain, Michael J.
  • 通讯作者:
    Strain, Michael J.
Thermally tuneable integrated diamond micro-disk resonators fabricated by micro-assembly
通过微组装制造的热可调集成金刚石微盘谐振器
{{ item.title }}
{{ item.translation_title }}
  • DOI:
    {{ item.doi }}
  • 发表时间:
    {{ item.publish_year }}
  • 期刊:
  • 影响因子:
    {{ item.factor }}
  • 作者:
    {{ item.authors }}
  • 通讯作者:
    {{ item.author }}

数据更新时间:{{ journalArticles.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ monograph.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ sciAawards.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ conferencePapers.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ patent.updateTime }}

Michael Strain其他文献

Understanding “Wage Theft”: Evasion and Avoidance Responses to Minimum Wage Increases
理解“工资盗窃”:对最低工资上涨的逃避和回避反应
Employment and Labor Supply Responses to the Child Tax Credit Expansion: Theory and Evidence
就业和劳动力供应对儿童税收抵免扩张的反应:理论和证据
  • DOI:
    10.2139/ssrn.4852991
  • 发表时间:
    2024
  • 期刊:
  • 影响因子:
    0
  • 作者:
    D. Schanzenbach;Michael Strain
  • 通讯作者:
    Michael Strain
Do Reemployment Bonuses Increase Employment? Evidence from the Idaho Return to Work Bonus Program
再就业奖金会增加就业吗?
Estimating the Employment Effects of Recent Minimum Wage Changes: Early Evidence, an Interpretative Framework, and a Pre-Commitment to Future Analysis
估计近期最低工资变化对就业的影响:早期证据、解释框架和对未来分析的预先承诺

Michael Strain的其他文献

{{ item.title }}
{{ item.translation_title }}
  • DOI:
    {{ item.doi }}
  • 发表时间:
    {{ item.publish_year }}
  • 期刊:
  • 影响因子:
    {{ item.factor }}
  • 作者:
    {{ item.authors }}
  • 通讯作者:
    {{ item.author }}

{{ truncateString('Michael Strain', 18)}}的其他基金

Zero-change manufacturing of photonic interconnects for silicon electronics
硅电子器件光子互连的零变化制造
  • 批准号:
    EP/V004859/1
  • 财政年份:
    2021
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Research Grant

相似海外基金

FuSe/Collaborative Research: Heterogeneous Integration in Power Electronics for High-Performance Computing (HIPE-HPC)
FuSe/合作研究:用于高性能计算的电力电子异构集成 (HIPE-HPC)
  • 批准号:
    2329063
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Continuing Grant
Collaborative Research: FuSe: Heterogeneous Integration of III-Nitride and Boron Arsenide for Enhanced Thermal and Electronic Performance
合作研究:FuSe:III族氮化物和砷化硼的异质集成以增强热和电子性能
  • 批准号:
    2329109
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Standard Grant
Collaborative Research: FuSe: Heterogeneous Integration of III-Nitride and Boron Arsenide for Enhanced Thermal and Electronic Performance
合作研究:FuSe:III族氮化物和砷化硼的异质集成以增强热和电子性能
  • 批准号:
    2329110
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Standard Grant
Collaborative Research: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS)
合作研究:FuSe:低损耗电磁和射频系统异构集成的热协同设计(CHILLERS)
  • 批准号:
    2329206
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Continuing Grant
Collaborative Research: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS)
合作研究:FuSe:低损耗电磁和射频系统异构集成的热协同设计(CHILLERS)
  • 批准号:
    2329208
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Continuing Grant
SBIR Phase II: Integration of Heterogeneous Device Technologies
SBIR 第二阶段:异构设备技术的集成
  • 批准号:
    2242381
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Cooperative Agreement
Collaborative Research: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS)
合作研究:FuSe:低损耗电磁和射频系统异构集成的热协同设计(CHILLERS)
  • 批准号:
    2329207
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Continuing Grant
Development of 1-chip LiDAR using 3D heterogeneous integration technology
利用3D异构集成技术开发1芯片LiDAR
  • 批准号:
    23H01472
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Collaborative Research: DESC: Type I: Towards Reduce- and Reuse-based Design of VLSI Systems with Heterogeneous Integration
合作研究:DESC:类型 I:采用异构集成实现基于缩减和重用的 VLSI 系统设计
  • 批准号:
    2324946
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Standard Grant
FuSe/Collaborative Research: Heterogeneous Integration in Power Electronics for High-Performance Computing (HIPE-HPC)
FuSe/合作研究:用于高性能计算的电力电子异构集成 (HIPE-HPC)
  • 批准号:
    2329062
  • 财政年份:
    2023
  • 资助金额:
    $ 41.19万
  • 项目类别:
    Continuing Grant
{{ showInfoDetail.title }}

作者:{{ showInfoDetail.author }}

知道了