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Production engineering research for the manufacture of novel electronically functional yarns for multifunctional smart textiles

多功能智能纺织品新型电子功能纱线的生产工程研究

基本信息

批准号：
EP/T001313/1
负责人：
Tilak Kithsiri Dias
金额：
$ 168.56万
依托单位：
Nottingham Trent University
依托单位国家：
英国
项目类别：
Research Grant
财政年份：
2019
资助国家：
英国
起止时间：
2019 至无数据
项目状态：
已结题

来源：
https://gtr.ukri.org/projects?ref=EP%2FT001313%2F1
关键词：
Production engineering research manufacture novel

项目摘要

This proposal is concerned with the research and development of new manufacturing methods that add electronic functionality to the heart of textiles by incorporating semiconductor devices into yarns. Textiles are one of the most common materials with which humans come into contact, but, at present, their functionality is limited to their appearance and physical properties. There is considerable and growing interest in multifunctional textiles with added electronic functionality: These will offer a far greater range of functionality that can include sensing, data processing and interaction with the user and, as a result, can be applied in a vast range of applications. Electronic textiles (E-textiles) need to not only perform well but also be robust, comfortable to wear and be readily used, worn, washed, and maintained.Currently, electronics have been integrated with textiles by either attaching or printing the electronics onto the surface of a textile (first generation), or the electronic functionality is added at the textile manufacturing stage (second generation). The first generation E-textiles will always interfere with the textile properties of a garment; even thin film devices or circuits printed on textiles. As a textile conforms to a shape some regions bend and some go into shear deformation: Both factors are important for drape and conformability. Knitted and woven textiles are able to conform to a shape as they bend and shear however, a thin polymer film can bend but, as it cannot shear, it will buckle and crumple rather than conform to a shape. The second generation textiles may retain a textile feel but are limited in their applications, such as the creation of electrical pathways, and electrode-based sensing. Therefore, Professor Dias (the PI) pioneered the development of a platform technology for embedding semiconductor packaged dice within the core of yarns, in order to integrate electronics into the heart of textile structures. The production process starts with re-flow soldering of package dice onto fine copper wire. A carrier yarn is placed in parallel to provide improved tensile strength to the copper wire populated with packaged dice. The package dice and carrier yarn are then encapsulated within polymer micro-pods to provide protection from moisture ingress. The micro-pod and copper interconnects are finally surrounded with additional fibres held tightly together within a knitted fibre sheath to create an electronic yarn (E-yarn).The aim of this project is to create the underlying knowledge to produce E-yarns in an automated fashion reliably, and to demonstrate an automated pilot manufacturing line (TRL4). The ability to produce E-yarns in a semi-automated fashion using two-terminal packaged dice has already been demonstrated by the investigators. The programme of research will extend this expertise to the reliable creation of E-yarns based on semiconductor devices with more than two terminals, massively extending the scope for the types of E-yarn that can be created. To achieve this ambitious goal the following research areas must be addressed: thermal energy management for soldering semiconductor dice; encapsulation of soldered dice; optimisation of the techniques of covering copper wires populated with dice to prevent their migration to the surface of the E-yarn; development of testing methods for the E-yarns. This proposal concerns a platform manufacturing technology that can address a range of E-textiles applications. The research will ensure that the technology can deliver the required functionality, meet the requirements of practical use, and provide the platform for commercialising the E-yarn technology. Project results will increase industry capability in the UK to lead the E-textile sector, which is expected to grow to a $5 billion market by 2028; hence the proposed research is timely.[1] www.idtechex.com/research/reports/e-textiles-2018-2028-technologies-markets-and-players-000613.asp

该提案涉及研究和开发新的制造方法，通过将半导体器件融入纱线，为纺织品的核心增加电子功能。纺织品是人类接触的最常见的材料之一，但目前，其功能仅限于其外观和物理特性。人们对具有附加电子功能的多功能纺织品的兴趣越来越大：这些纺织品将提供更广泛的功能，包括传感，数据处理和与用户的互动，因此可以应用于广泛的应用。电子纺织品（E-textiles）不仅需要性能良好，还需要坚固耐用，穿着舒适，易于使用，磨损，洗涤和维护。目前，电子产品已经通过将电子产品附着或印刷到纺织品表面（第一代）与纺织品集成，或者在纺织品制造阶段添加电子功能（第二代）。第一代电子纺织品总是会干扰服装的纺织品特性，甚至是印刷在纺织品上的薄膜器件或电路。当织物符合形状时，一些区域弯曲，一些区域进入剪切变形：这两个因素对悬垂性和顺应性都很重要。针织和机织纺织品在它们弯曲和剪切时能够符合形状，然而，薄聚合物膜可以弯曲，但是由于它不能剪切，它将弯曲和起皱而不是符合形状。第二代纺织品可以保留纺织品感觉，但在其应用中受到限制，例如电通路的创建和基于电极的感测。因此，Dias教授（PI）率先开发了一种平台技术，用于将半导体封装芯片嵌入纱线芯中，以便将电子器件集成到纺织结构的核心中。生产过程开始于将封装芯片回流焊接到细铜线上。平行地放置载体纱线，以向填充有封装芯片的铜线提供改进的抗拉强度。然后，将包装管芯和载体纱线封装在聚合物微荚内，以防止水分进入。微荚和铜互连最终被编织纤维鞘内紧密结合在一起的额外纤维包围，以创建电子纱线（E-yarn）。该项目的目的是创建以自动化方式可靠地生产电子纱线的基础知识，并演示自动化中试生产线（TRL 4）。研究人员已经证明了使用双端包装骰子以半自动方式生产电子纱线的能力。该研究计划将把这种专业知识扩展到基于具有两个以上端子的半导体器件的电子纱线的可靠创建，从而大大扩展了可以创建的电子纱线类型的范围。为了实现这一雄心勃勃的目标，必须解决以下研究领域：焊接半导体芯片的热能管理;焊接芯片的封装;优化覆盖铜线的技术，以防止其迁移到E-纱线的表面;开发E-纱线的测试方法。该提案涉及一种平台制造技术，可以解决一系列电子纺织品的应用。该研究将确保该技术能够提供所需的功能，满足实际使用的要求，并为电子纱线技术的商业化提供平台。项目结果将提高英国引领电子纺织品行业的行业能力，预计到2028年将增长到50亿美元的市场;因此，拟议的研究是及时的。[1]www.idtechex.com/research/reports/e-textiles-2018-2028-technologies-markets-and-players-000613.asp

项目成果

期刊论文数量（9）

专著数量（0）

科研奖励数量（0）

会议论文数量（0）

专利数量（0）

The Design and Development of Woven Textile Solar Panels.

DOI：
10.3390/ma16114129
发表时间：
2023-06-01
期刊：
MATERIALS
影响因子：
3.4
作者：
Abeywickrama, Neranga;Kgatuke, Matholo;Marasinghe, Kalana;Nashed, Mohamad Nour;Oliveira, Carlos;Shahidi, Arash M.;Dias, Tilak;Hughes-Riley, Theodore
通讯作者：
Hughes-Riley, Theodore

The Design and Development of Electronic Textiles for Health Monitoring Applications

用于健康监测应用的电子纺织品的设计和开发