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Millimetre-wave and Terahertz On-chip Circuit Test Cluster for 6G Communications and Beyond (TIC6G)

适用于 6G 及以上通信的毫米波和太赫兹片上电路测试集群 (TIC6G)

基本信息

批准号：
EP/W006448/1
负责人：
Edward Wasige
金额：
$ 335.06万
依托单位：
University of Glasgow
依托单位国家：
英国
项目类别：
Research Grant
财政年份：
2022
资助国家：
英国
起止时间：
2022 至无数据
项目状态：
未结题

来源：
https://gtr.ukri.org/projects?ref=EP%2FW006448%2F1
关键词：
Millimetre wave Terahertz chip Circuit

项目摘要

The internet transmits data with a rate of hundreds of Terabits per second (Tbit/s), consumes 9% of the worldwide produced electrical energy and is growing at a rate of 20 - 30 % per year. One single carrier produced by a laser diode, can provide the data transmission of 26 Tbit/s. By combining optical carriers with TeraHertz (THz) waves as well, data rates of several Tbit/s can be transmitted over a wireless link, which will enable hybrid optical/THz wireless links. The next/sixth generation (6G) communication network is expected to be commercialised from 2030. 6G will generate greater diffusion and provide technical platforms to solve social, economic and humanity issues with higher data rates, wider bandwidth and lower latency. The urgency and challenges require the development of revolutionary technologies to meet the projected performance levels. These developments are captured in the recent beyond-5G roadmaps from research forums such as WWRF, NetWorld2020, H2020 5G-PPP, 6G-Summit, USA NSF, industry organizations including 3GPP, IEEE, ETSI, ITU-R, ITU-T, and spectrum regulatory forums e.g., FCC, ECC, OFCOM, WRC'19 [https://doi.org/10.3390/electronics9020351].At the University of Glasgow (UofG), more than 10 research groups in James Watt School of Engineering are working on enabling technologies in the area of wireless communications, optical networking and a mix of fibre optics, millimetre wave and ultrafast THz wireless links. Such concepts require novel semiconductor devices and circuits that must be characterised at an early stage of development, i.e. at chip level, once they are manufactured at our James Watt Nanofabrication Centre (JWNC). To support this research, this project aims to establish an on-chip device and integrated circuit test cluster together with a carrier independent, ultra-high data transmission rate and processing system to measure key performance indicators in both the user and control planes. The proposed Test Cluster is the first of this kind in the world that allows complex signal and waveforms directly deployed to devices under test on chip. This will trigger new device concepts as well as enable development of transceiver architectures. This work will potentially create industry game changers.The Cluster consists of three key modules: waveform generation, signal analysis, and device characterisation. The three modules can operate individually or collectively and are built around a semi-automated probe station and an optical bench to allow on-chip probing, quasi-optics coupling and over-the-air characterisation setups. The waveform generation module can generate CW and wideband high-speed complex waveforms (>40 GHz) to meet the requirements of future communications for frequencies up to 1.1 THz. The signal analysis module can perform spectrum analysis of signal sources as well as real-time signal analysis on ultra-wideband, high data rate, complex signals in time domain for frequencies up to 1.1 THz. The device characterisation module permits continuous/pulsed current-voltage, network analysis and active load-pull measurements up to 1.1 THz. We are targeting measurements in hybrid transmission systems of several hundred Gigabits per second (Gbit/s). To allow other external groups and industry to use this unique measurement system for their research and development, a key aspect of the new measurement system is the possibility for remote control of all parameters via the Internet, which will enable use of the measurement system without the need to move the measurement system around and allow remote access to real-time data.

互联网以每秒数百太比特（Tbit/s）的速率传输数据，消耗全球产生的电能的9%，并且以每年20 - 30%的速度增长。由一个激光二极管产生的单载波，可以提供26 Tbit/s的数据传输。通过将光载波与太赫兹（THz）波相结合，可以在无线链路上传输数Tbit/s的数据速率，这将实现混合光/THz无线链路。下一代/第六代（6 G）通信网络预计将从2030年开始商用。6 G将产生更大的扩散，并提供技术平台，以更高的数据速率，更宽的带宽和更低的延迟来解决社会，经济和人类问题。紧迫性和挑战要求开发革命性的技术，以满足预期的性能水平。这些发展在来自研究论坛（如WWRF、NetWorld 2020、H2020 5G-PPP、6 G-Summit、USA NSF）、行业组织（包括3GPP、IEEE、ETSI、ITU-R、ITU-T）和频谱监管论坛（例如，FCC、ECC、OFCOM、WRC'19 [https：//doi.org/10.3390/electronics9020351].在格拉斯哥大学（UofG），詹姆斯·瓦特工程学院的10多个研究小组正在研究无线通信、光学网络以及光纤、毫米波和超快THz无线链路混合领域的使能技术。这些概念需要新的半导体器件和电路，必须在开发的早期阶段，即在芯片级，一旦它们在我们的詹姆斯瓦特纳米制造中心（JWNC）制造。为了支持这项研究，该项目旨在建立一个片上器件和集成电路测试集群，以及一个独立于载波的超高数据传输速率和处理系统，以测量用户和控制平面的关键性能指标。拟议的测试集群是世界上第一个允许复杂信号和波形直接部署到芯片上被测设备的测试集群。这将引发新的设备概念，并使收发器架构的发展成为可能。该集群由三个关键模块组成：波形生成、信号分析和器件表征。这三个模块可以单独或共同操作，并围绕半自动探针台和光具座构建，以实现片上探测、准光学耦合和空中表征设置。波形生成模块可生成CW和宽带高速复杂波形（>40 GHz），以满足未来通信对高达1.1 THz频率的要求。信号分析模块可以对信号源进行频谱分析，并对频率高达1.1 THz的超宽带、高数据速率、时域复杂信号进行实时信号分析。器件特性模块允许连续/脉冲电流电压、网络分析和高达1.1 THz的有源负载牵引测量。我们的目标是在混合传输系统的测量几百千兆比特每秒（Gbit/s）。为了使其他外部团体和行业能够使用这种独特的测量系统进行研发，新测量系统的一个关键方面是可以通过互联网远程控制所有参数，这将使测量系统的使用无需移动测量系统，并允许远程访问实时数据。