Millimetre-wave and Terahertz On-chip Circuit Test Cluster for 6G Communications and Beyond (TIC6G)

适用于 6G 及以上通信的毫米波和太赫兹片上电路测试集群 (TIC6G)

基本信息

批准号：
EP/W006448/1
负责人：
Edward Wasige
金额：
$ 335.06万
依托单位：
University of Glasgow
依托单位国家：
英国
项目类别：
Research Grant
财政年份：
2022
资助国家：
英国
起止时间：
2022 至无数据
项目状态：
未结题

来源：
https://gtr.ukri.org/projects?ref=EP%2FW006448%2F1
关键词：
Millimetre wave Terahertz chip Circuit

项目摘要

The internet transmits data with a rate of hundreds of Terabits per second (Tbit/s), consumes 9% of the worldwide produced electrical energy and is growing at a rate of 20 - 30 % per year. One single carrier produced by a laser diode, can provide the data transmission of 26 Tbit/s. By combining optical carriers with TeraHertz (THz) waves as well, data rates of several Tbit/s can be transmitted over a wireless link, which will enable hybrid optical/THz wireless links. The next/sixth generation (6G) communication network is expected to be commercialised from 2030. 6G will generate greater diffusion and provide technical platforms to solve social, economic and humanity issues with higher data rates, wider bandwidth and lower latency. The urgency and challenges require the development of revolutionary technologies to meet the projected performance levels. These developments are captured in the recent beyond-5G roadmaps from research forums such as WWRF, NetWorld2020, H2020 5G-PPP, 6G-Summit, USA NSF, industry organizations including 3GPP, IEEE, ETSI, ITU-R, ITU-T, and spectrum regulatory forums e.g., FCC, ECC, OFCOM, WRC'19 [https://doi.org/10.3390/electronics9020351].At the University of Glasgow (UofG), more than 10 research groups in James Watt School of Engineering are working on enabling technologies in the area of wireless communications, optical networking and a mix of fibre optics, millimetre wave and ultrafast THz wireless links. Such concepts require novel semiconductor devices and circuits that must be characterised at an early stage of development, i.e. at chip level, once they are manufactured at our James Watt Nanofabrication Centre (JWNC). To support this research, this project aims to establish an on-chip device and integrated circuit test cluster together with a carrier independent, ultra-high data transmission rate and processing system to measure key performance indicators in both the user and control planes. The proposed Test Cluster is the first of this kind in the world that allows complex signal and waveforms directly deployed to devices under test on chip. This will trigger new device concepts as well as enable development of transceiver architectures. This work will potentially create industry game changers.The Cluster consists of three key modules: waveform generation, signal analysis, and device characterisation. The three modules can operate individually or collectively and are built around a semi-automated probe station and an optical bench to allow on-chip probing, quasi-optics coupling and over-the-air characterisation setups. The waveform generation module can generate CW and wideband high-speed complex waveforms (>40 GHz) to meet the requirements of future communications for frequencies up to 1.1 THz. The signal analysis module can perform spectrum analysis of signal sources as well as real-time signal analysis on ultra-wideband, high data rate, complex signals in time domain for frequencies up to 1.1 THz. The device characterisation module permits continuous/pulsed current-voltage, network analysis and active load-pull measurements up to 1.1 THz. We are targeting measurements in hybrid transmission systems of several hundred Gigabits per second (Gbit/s). To allow other external groups and industry to use this unique measurement system for their research and development, a key aspect of the new measurement system is the possibility for remote control of all parameters via the Internet, which will enable use of the measurement system without the need to move the measurement system around and allow remote access to real-time data.

互联网以每秒数百吨（TBIT/s）的数百辆速率传输数据，消耗了9％的全球产生的电能，并且每年以20-30％的速度增长。一个由激光二极管产生的单个载体可以提供26 Tbit/s的数据传输。通过将光载体与Terahertz（THZ）波相结合，可以通过无线链路传输多个TBIT/S的数据速率，这将启用混合光学/THZ无线链路。预计下一代/第六代（6G）的通信网络将从2030年开始商业化。6G将产生更大的扩散，并提供技术平台，以较高的数据速率，更宽的带宽和较低的延迟来解决社会，经济和人类问题。紧迫性和挑战需要开发革命性技术，以达到预计的绩效水平。这些发展是在WWRF，NetWorld2020，H2020 5G-PPP，6G-Summit，美国NSF等研究论坛的最新5G路线图中捕获的，NSF，包括3GPP，IEEE，ETSI，ETSI，ETSI，ITU-R，ITU-R，ITU-T，ITU-T，ITU-T，ITU-T和SPECTRUM调节论坛，例如[https://doi.org/10.3390/electronics9020351]在格拉斯哥大学（UOFG）中，詹姆斯·瓦特工程学院的10多个研究小组正在从事无线通信领域的启用技术，光纤网络和光纤，毫米级别，无用的链接链接。这样的概念需要新颖的半导体设备和电路，这些设备和电路必须在开发的早期阶段（即芯片水平）进行表征，一旦我们的詹姆斯·瓦特纳米制造中心（JWNC）制造了它们。为了支持这项研究，该项目旨在建立一个片上设备和集成电路测试集群以及载体独立，超高的数据传输速率和处理系统，以衡量用户和控制平面中的关键性能指标。提出的测试群集是世界上第一个，它允许将复杂的信号和波形直接部署到芯片上正在测试的设备上。这将触发新的设备概念，并启用收发器体系结构的开发。这项工作可能会创建行业改变者。该集群由三个关键模块组成：波形生成，信号分析和设备表征。这三个模块可以单独或集体运行，并围绕一个半自动化的探针站和光学台面构建，以允许芯片探测，准选项耦合和空中表征设置。波形生成模块可以生成CW和宽带高速复合波形（> 40 GHz），以满足未来通信的要求，最高为1.1 THz。信号分析模块可以对信号源进行频谱分析以及超宽带，高数据速率，时域中的复杂信号的实时信号分析，最高为1.1 THz。设备表征模块允许连续/脉冲电流电压，网络分析和高达1.1 THz的主动载荷测量值。我们正在针对每秒几百吉比特（GBIT/s）的混合传输系统中的测量。为了允许其他外部群体和行业使用此独特的测量系统进行研究和开发，新测量系统的关键方面是通过Internet远程控制所有参数的可能性，这将使您能够使用测量系统，而无需将测量系统移动到周围并允许远程访问实时数据。