High-specification nanofabrication equipment: enabling increased capability and capacity for electronics, spintronics, photonics, and bioelectronics.

高规格纳米制造设备：提高电子学、自旋电子学、光子学和生物电子学的能力和容量。

• 批准号: EP/W006472/1
• 负责人: Edmund Harold Linfield
• 金额: $ 329.76万
• 依托单位: University of Leeds
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2022
• 资助国家: 英国
• 起止时间: 2022 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FW006472%2F1
• 关键词: specification; nanofabrication; equipment; enabling; increased

In March 2021, the University of Leeds took ownership of its £96M Sir William Henry Bragg Building, which will bring the Schools of Physics & Astronomy, and Computing, into the North East quarter of the University, next to the Schools of Chemistry, Electronic & Electrical Engineering, Mechanical Engineering, Civil Engineering, and Chemical & Process Engineering. In parallel, the University has established the Bragg Centre for Materials Research, which brings together more than 200 materials researchers from across campus to foster a vibrant and creative community of scientists and engineers to inspire and facilitate ground-breaking and interdisciplinary research to meet global challenges.At the heart of the Bragg community is the Leeds Nanotechnology Cleanroom, which was established in 2002, and over the last twenty years has significantly expanded its activities to support a breadth of research across the University, including spintronic, opto-electronic and bioelectronic materials and devices. It is now also used extensively by external industry and academia, and has led to the training of over 200 researchers over the last decade. The Cleanroom is currently moving into new, larger, and significantly enhanced accommodation in the Sir William Henry Bragg Building. This will triple the maximum number of daily Cleanroom users, and provide a significant enhancement in the environment and capabilities for device processing (e.g. enabling gas chemistries hitherto not possible). The 730 m2 new facility is future-proofed (with a further 99 m2 fallow space for expansion) and constructed to the highest levels of specification, including bays at ISO 4 (class 10) specification and temperature stability of 0.1 degC/hr. There are also eight class 10 lamina wet benches, and 31 quiet islands for vibration-sensitive equipment. This is accompanied by 20 specialist gas cabinets for flammable, corrosive and inert gases with associated gas pipes and valve manifold boxes, as well as point of use, vent and catastrophic abatement systems, accompanied by a gas detector network for specialist gases and O2 depletion.Current equipment includes: direct-write and mask-based photolithography; electron-beam lithography; thermal and electron-beam evaporation, sputtering and atomic layer deposition; ion beam etching; wafer and die bonding, lapping and dicing; rapid thermal annealing; electron and atomic force microscopy, and ellipsometry; and, test and packaging. All can be used for piece parts (e.g. 6 mm x 6 mm dies), with most being scalable to 4" wafers. The equipment is available to all users, and enables them to develop bespoke processes.However, there is currently a lack of reactive-gas etching and deposition systems. This programme will address this through the provision of:1) A silicon deep reactive ion etcher, providing high aspect ratio and through-wafer etching of silicon. 2) An open-load, parallel-plate reactive ion etcher (RIE), which will be used to realise 'teflon-like' coatings to aid demoulding during microfluidics fabrication, and for shallow dielectric etching.3) An inductively-coupled-plasma RIE for dry-etching a wide range of materials including oxides, nitrides, polymers and refractory metals. 4) High-density, plasma-enhanced chemical vapour deposition to enable coating with dielectric cladding layers, e.g. for photonic waveguides.These instruments will lead to the fabrication of electronic, optoelectronic and spintronics devices with significantly higher yields, and greatly improved device/materials properties. The substantial reductions in process development time will offer immediate benefit. They will also enable the patterning of materials, and realisation of device structures at Leeds that simply could not be contemplated previously, underpinning future research for the next decade and beyond across the engineering, physical, biological and medical sciences, and its translation to industry.

2021年3月，利兹大学接管了其高达96米的威廉·亨利·布拉格爵士大楼，该大楼将把物理、天文和计算学院纳入大学东北区，毗邻化学、电子和电气工程、机械工程、土木工程和化学与工艺工程学院。同时，该大学还建立了布拉格材料研究中心，该中心汇集了来自校园各地的200多名材料研究人员，培养了一个充满活力和创造性的科学家和工程师社区，以激励和促进突破性和跨学科的研究，以应对全球挑战。布拉格社区的核心是利兹纳米技术净室，该中心成立于2002年，在过去20年中显著扩大了其活动，以支持整个大学的广泛研究，包括自旋电子、光电子和生物电子材料和设备。它现在也被外部工业界和学术界广泛使用，并在过去十年中培训了200多名研究人员。洁净室目前正在搬入威廉·亨利·布拉格爵士大楼的新的、更大的、显著增强的住所。这将使每天使用洁净室的最大人数增加三倍，并显著改善设备处理的环境和能力(例如，启用迄今为止不可能实现的气体化学处理)。730平方米的新设施是面向未来的(还有99平方米的休耕空间可供扩展)，并以最高级别的规格建造，包括ISO 4(10类)规格的托架和0.1摄氏度/小时的温度稳定性。还有8个10级板材湿板凳和31个用于振动敏感设备的安静岛。随之而来的是20个用于易燃、腐蚀性和惰性气体的专业气柜，以及相关的气体管道和阀门歧管盒，以及使用点、排气和灾难性消除系统，以及用于专业气体和氧气消耗的气体探测器网络。目前的设备包括：直写和掩模光刻；电子束光刻；热和电子束蒸发、溅射和原子层沉积；离子束蚀刻；晶片和芯片接合、研磨和切割；快速热退火；电子和原子力显微镜；椭圆术；以及测试和封装。所有芯片均可用于片式零件(例如，6 mm x 6 mm芯片)，其中大多数可扩展到4英寸晶圆。该设备可供所有用户使用，并使他们能够开发定制的工艺。但是，目前还缺乏反应气体刻蚀和沉积系统。该计划将通过提供：1)硅深反应离子刻蚀器，提供高纵横比和硅的穿透刻蚀来解决这一问题。2)开放负载、平行板反应离子蚀刻机(RIE)，用于实现微流体制造过程中帮助脱模的‘特氟龙’涂层，以及用于浅层介质蚀刻。3)用于干法蚀刻各种材料的感应耦合等离子体RIE。4)高密度、等离子体增强的化学气相沉积，以实现介质包覆层的涂层，例如用于光子波导。这些设备将导致制造出更高成品率的电子、光电子和自旋电子器件，并极大地改善器件/材料的性能。流程开发时间的大幅减少将带来立竿见影的好处。它们还将在利兹实现材料的图案化和设备结构的实现，这是以前无法想象的，为未来十年及以后工程、物理、生物和医学领域的研究奠定了基础，并将其转化为工业。