New Power Device Architectures in Silicon
New Power Device Architectures in Silicon
批准号:
1724376
负责人:
金额:
$0.0万
依托单位:
依托单位国家:
英国
项目类别:
Studentship
财政年份:
2016
资助国家:
英国
项目状态:
已结题
起止时间:
2016 至 --
中文摘要
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英文摘要
Silicon has dominated the power semiconductor device market for the past 60 years and today still accounts for over 99%. Power devices are an enabling technology to many electrical systems and are becoming increasingly significant as low-carbon energy sources usurp traditional fossil fuels. Development of renewable energy such as wind and solar, transportation including trains and electric cars and the development of the UK "smart grid" network, to name but a few applications, would not be possible without a highly efficient power device. Therefore, research to understand the behaviour of current silicon power devices in order to improve performance is highly relevant to today's society. Over the past 20 years there have been many developments in silicon devices including the invention of the 3D reduced surface field effect (RESURF) which broke the perceived classical limit of silicon, the trench gate IGBT which overcame the constraint presented by planar IGBTs by enhancing the PiN diode effect and the use of lateral device structures in high voltage integrated circuits as an alternative to discrete devices due to increased reliability, efficiency and a reduction in overall size.To build upon these developments, it is important that I first understand each power device in detail and this will form the initial stages of my PhD. Having narrowed my field to a particular application and device, I intend to develop accurate models in order to fully characterise the current device behaviour to enable further optimisation to occur. By employing some of the existing device concepts, I hope to design a new power device with improved performance and efficiency. Tests will be conducted using both simulation output and experimental data by manufacturing the device in silicon. It is hoped that, as a result of completing this research, the new design will contribute towards the ever growing need for efficient power devices across the wide breadth of industries.
期刊论文(7)
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科研奖励(0)
会议论文
Investigation of the Dual Implant Reverse-Conducting SuperJunction Insulated-Gate Bipolar Transistor
DOI:
10.1109/led.2019.2911994
发表时间:
2019-04
期刊:
IEEE Electron Device Letters
影响因子:
4.9
作者:
[E. Findlay;F. Udrea;M. Antoniou]
通讯作者:
E. Findlay;F. Udrea;M. Antoniou
Modeling of Large Area Trench IGBTs: The Effect of Birds-Beak
大面积沟槽 IGBT 建模:鸟嘴效应
DOI:
10.1109/ted.2019.2911020
发表时间:
2019
期刊:
IEEE Transactions on Electron Devices
影响因子:
3.1
作者:
[Findlay E]
通讯作者:
Findlay E
Coordinated Switching with SiC MOSFET for Increasing Turn-off dV/dt of Si IGBT
与 SiC MOSFET 协调开关以提高 Si IGBT 的关断 dV/dt
DOI:
10.1109/ecce.2018.8557666
发表时间:
2018
期刊:
影响因子:
--
作者:
[Palmer P]
通讯作者:
Palmer P
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