Flat panel technology for XFEL

XFEL 平板技术

• 批准号: ST/G000948/1
• 负责人: Valentine O'Shea
• 金额: $ 39.46万
• 依托单位: University of Glasgow
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2008
• 资助国家: 英国
• 起止时间: 2008 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=ST%2FG000948%2F1
• 关键词: Flat; panel; technology; XFEL

Recent experience with assembling our existing Xchip for a high volume scanning application has demonstrated the ability to 'TAB' (Tape Automated Bonding) our ASICs to kapton interconnect ~50microns thick. Using this approach a number of MCMD solutions have been considered. In one possible arrangement the IO signalling of the readout ASIC are TAB connected to a kapton strip extension from the readout PCB. The ASICs are then tested as the module is assembled prior to sensor bonding. The sensor then connects using a relatively thick interconnect method / e.g. stacks of gold balls for small volume or indium for larger volumes etc. Alternatives where the sensor connections are tabbed directly to kapton ribbons to rows of pads on the ASIC are also being considered. These approaches are considered quite novel by the designers and is something that we wish to decouple from the critical path / hence we have included it as a 'proof of concept' development rather than rely on it for the delivery of our complete prototype. Note that this scheme still uses the same ASIC design, it is simply reversed (rotated 180 degrees) so that it is completely 'behind' the sensor.

最近的经验与组装我们现有的Xchip的大容量扫描应用已经证明了'TAB'（磁带自动键合）的能力，我们的ASIC到Kapton互连~ 50微米厚。使用这种方法的MCMD解决方案的数量已被考虑。在一种可能的布置中，读出ASIC的IO信令被TAB连接到来自读出PCB的Kapton带延伸部。然后，在传感器焊接之前，在组装模块时对ASIC进行测试。然后，传感器使用相对较厚的互连方法进行连接/例如，对于小体积使用金球堆叠，或者对于较大体积使用铟堆叠等。也正在考虑将传感器连接直接连接到ASIC上的kapton带和焊盘行的替代方案。这些方法被设计师认为是相当新颖的，是我们希望从关键路径解耦的东西，因此我们将其作为“概念验证”开发，而不是依赖于它来交付我们的完整原型。请注意，该方案仍然使用相同的ASIC设计，只是简单地反转（旋转180度），使其完全“落后”传感器。

项目成果

Characterisation of edgeless technologies for pixellated and strip silicon detectors with a micro-focused X-ray beam

采用微聚焦 X 射线束的像素化和带状硅探测器的无边缘技术的表征

• DOI: 10.1088/1748-0221/8/01/p01018
• 发表时间: 2013
• 期刊: Journal of Instrumentation
• 影响因子: 1.3
• 作者: Bates R

Scribe-cleave-passivate (SCP) slim edge technology for silicon sensors

适用于硅传感器的划线-切割-钝化 (SCP) 薄边技术

• DOI: 10.1016/j.nima.2013.03.046
• 发表时间: 2013
• 期刊: Accelerators, Spectrometers, Detectors and Associated Equipment
• 作者: Fadeyev V

Edgeless sensor development for the LPD hybrid pixel detector at XFEL

XFEL 为 LPD 混合像素探测器开发无边缘传感器

• DOI: 10.1016/j.nima.2009.03.114
• 发表时间: 2009
• 期刊: Accelerators, Spectrometers, Detectors and Associated Equipment
• 作者: Blue A