Immunocompatible electronic polymers and devices for implantable sensors and stimulators that resist foreign-body responses
用于抵抗异物反应的植入式传感器和刺激器的免疫相容性电子聚合物和设备
基本信息
- 批准号:10473319
- 负责人:
- 金额:$ 136.49万
- 依托单位:
- 依托单位国家:美国
- 项目类别:
- 财政年份:2022
- 资助国家:美国
- 起止时间:2022-09-19 至 2025-08-31
- 项目状态:未结题
- 来源:
- 关键词:AddressAnimal TestingArchitectureAreaBiochemicalBiocompatible MaterialsBiologicalCategoriesCellsCollagenDevelopmentDevice or Instrument DevelopmentDevicesElectronicsElectrophysiology (science)EngineeringEquipment MalfunctionFDA approvedFamilyForeign BodiesHuman bodyHydrogelsImmuneImmune systemImmunologyIn VitroIndividualInflammationLongevityMediatingMedicalMorphologyPathologicPerformancePhysicsPolymersReactionResearchScienceSemiconductorsSignal TransductionTestingTissuesTransistorsbasechemical propertydesigndisease diagnosiselectrical propertyimplantable deviceimplanted sensorin vivoinnovationmedical specialtiesphysical propertyresponserestorationsensor
项目摘要
PROJECT SUMMARY
In recent decades, bioimplants in human bodies have been more and more routinely used in almost every
biomedical specialty, with the functions ranging from pathological and biological studies to medical treatments
and restoration of body functions. Among all the different types of bioimplants, implantable electronic devices
comprise a major category that provide highly accurate and programmed signal transductions. However, the
longevity and stability of all types of bioimplants, including electronic devices, have been facing a common
challenge, that is the excessive ingrowth of collagen and inflammation reactions around the device, which have
been known as “foreign-body response (FBR)”—a type of immune-mediated reaction on foreign/synthetic
material “invaders”. Even for the most successful, FDA-approved bioimplants that have been used for decades,
excessive FBR can be provoked in many individuals, which is the primary cause of the device failure before their
desired functional periods. For solving this commonly existing grand challenge, although a substantial amount
of efforts has been made in the development of new biomaterial designs for suppressing FBR, the research has
been almost exclusively focused on insulating-type polymers/hydrogels. To proceed to the next horizon of solving
the immune-compatibility problem for implantable electronics using the most promising material family—
electronic polymers, it is vitally important for us to develop a set of innovative material designs for electronic
polymers for concurrently achieving superior immune compatibility and high electrical property. We propose to
achieve this by intellectually addressing the extraordinary challenge of unprecedentedly interfacing immunology
with semiconductor physics and polymer sciences, and experimentally combine the approaches of polymer
synthesis, morphological engineering, device fabrication, electrical characterizations, in vitro cell tests, and in
vivo animal tests. Specifically, the focuses of this research include four aspects: 1) developing new designs of
semiconducting and conducting polymers for achieving immunocompatible chemical property; 2) developing
“hydrogel-architecture” polymer semiconductors for realizing tissue-level elastic moduli for achieving
immunocompatible physical property; 3) in vitro and in vivo study of the elicited FBR by these immunocompatible
designs of electronic polymers; 4) combining the material and device developments to realize proof-of-concept
immunocompatible devices, including electrophysiological devices, and transistor-based biochemical sensors.
Based on the highly important uses of implantable electronics, we envision the realization of immunocompatible
electronic devices from this research will create significant benefits and far-reaching impacts to a wide spectrum
of biomedical areas.
项目摘要
近几十年来,人体中的生物植物几乎越来越常规地使用
生物医学专业,其功能从病理和生物学研究到医疗治疗不等
并恢复身体功能。在所有不同类型的生物植物中,可植入的电子设备
组成一个主要类别,提供高度准确和编程的信号翻译。但是,
所有类型的生物植物的寿命和稳定性,包括电子设备,一直面临着常见
挑战,即胶原蛋白和设备周围的炎症反应的过量渗透,
被称为“外国体反应(FBR)” - 一种对外国/合成的免疫介导的反应
物质“入侵者”。即使是使用数十年来使用的最成功,最成功的FDA批准的生物植物,
过多的FBR可以在许多人中引起,这是设备故障之前的主要原因
所需的功能周期。解决这个常见的大挑战,尽管大量
在开发用于抑制FBR的新生物材料设计方面已经付出了努力,该研究已经
几乎完全专注于绝缘型聚合物/水凝胶。前往下一个解决方案
使用最有希望的材料家族的可植入电子产品的免疫兼容问题 -
电子聚合物,对于我们来说,为电子产品开发一组创新的材料设计至关重要
聚合物,可同时实现出色的免疫兼容性和高电性能。我们建议
通过明智地解决空前接口免疫学的非凡挑战来实现这一目标
使用半导体物理学和聚合物科学,并实验结合了聚合物的方法
合成,形态工程,装置制造,电特征,体外细胞测试以及
体内动物测试。具体而言,这项研究的重点包括四个方面:1)开发的新设计
半导体和导电聚合物,以实现免疫创化学性质; 2)发展
“水凝胶 - 结构”聚合物半导体,用于实现组织级弹性模量实现
免疫兼容的物理特性; 3)通过这些免疫同相引起的FBR的体外和体内研究
电子聚合物的设计; 4)结合材料和设备开发以实现概念证明
免疫兼容的设备,包括电生理设备和基于晶体管的生化传感器。
基于植入电子产品的非常重要的用途,我们设想实现免疫同相
这项研究的电子设备将对广泛的范围产生重大的好处和深远的影响
生物医学区域。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Sihong Wang的其他文献
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{{ item.author }}
{{ truncateString('Sihong Wang', 18)}}的其他基金
Heat Shock Effects on Human Mesenchymal Stem Cell Differentiation in Hydrogel
热休克对水凝胶中人间充质干细胞分化的影响
- 批准号:
7693161 - 财政年份:2009
- 资助金额:
$ 136.49万 - 项目类别:
Heat Shock Effects on Human Mesenchymal Stem Cell Differentiation in Hydrogel
热休克对水凝胶中人间充质干细胞分化的影响
- 批准号:
7922104 - 财政年份:2009
- 资助金额:
$ 136.49万 - 项目类别:
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