Chemical mechanical polish equipment for nanofabrication research

用于纳米制造研究的化学机械抛光设备

• 批准号: 359356-2008
• 负责人: Cadien, Kenneth
• 金额: $ 10.73万
• 依托单位: University of Alberta
• 依托单位国家: 加拿大
• 项目类别: Research Tools and Instruments - Category 1 (<$150,000)
• 财政年份: 2007
• 资助国家: 加拿大
• 起止时间: 2007-01-01 至 2008-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=361651
• 关键词: Chemical; mechanical; polish; equipment; nanofabrication

Chemical mechanical polish (CMP) is a technology that has revolutionized the semiconductor industry.  It was first used to planarize the interlayer dielectric and permit multilayer interconnect structures in integrated circuits. It was then used for shallow trench isolation for devices, and then to polish tungsten plugs to enable vertically stacked vias.  More recently, CMP has enabled the use of copper interconnects.  Copper is not readily patterned by conventional subtractive techniques, and CMP enabled to use of the Damascene approach.   Today, CMP has grown from initial use on one layer, to use on more than fifteen layers.  It is clear that CMP will continue to enable future generations of devices, however significant challenges remain.  In the next 10-15 years, CMP will need dramatic improvements and breakthroughs, as laid out in the 2005 International Technology Roadmap for Semiconductors, in order meeting ever more stringent performance targets and to enable novel materials that may be incorporated into future devices.  The CMP equipment will enable Dr. Cadien's research team at the University of Alberta to explore the invention and discovery of novel slurries and pads that will enable the next generation devices.  His team will also explore the application of CMP to nano electro mechanical devices and to the packaging of these devices.

化学机械抛光（CMP）是一种彻底改变半导体工业的技术，它首先用于平坦化层间电介质，并允许在集成电路中形成多层互连结构。后来，它被用于器件的浅沟槽隔离，然后用于抛光钨塞，以实现垂直堆叠的通孔。最近，CMP使铜互连的使用成为可能。铜不容易通过传统的减法技术进行图案化，CMP使大马士革方法的使用成为可能。 今天，CMP已经从最初的一层发展到超过15层。很明显，CMP将继续使未来几代器件成为可能，但仍然存在重大挑战。在未来10-15年内，CMP将需要巨大的改进和突破，正如2005年国际半导体技术路线图所述，CMP设备将使阿尔伯塔大学的Cadien博士的研究小组能够探索发明和发现新的浆料和衬垫，从而使下一代CMP设备能够在未来的设备中使用。他的团队还将探索CMP在纳米机电设备和这些设备的包装中的应用。