Practical approaches towards building nanoscale architechtures

纳米结构仍然是密集研究的焦点，因为它们迷人的性质可以与它们的块体结构截然不同，从而显示出巨大的应用前景。例如，复杂的金属和有机结构正在成为纳米级电子、磁、光子和生物传感设备中芯片互连和有源组件的重要构建块。这些未来应用所需的关键成分之一是通过组装、图案化和在技术上相关的固体载体(如半导体表面)上对准来集成大量可寻址的纳米结构的能力。挑战在于以经济可行的方式制造大面积的高密度纳米结构，其特征尺寸远低于100纳米。对于即将到来的半导体工业协会(SIA)路线图中的亚45纳米一代，光刻技术理所当然地仍将是一项核心技术，但大规模制造的成本考虑将是一个关键制约因素。因此，人们对涉及大规模自组装的互补图案化策略的开发感兴趣，以用作用于纳米结构开发的软有机模板。虽然在SIA路线图中，嵌段共聚模板被认为是一种潜在的亚45纳米特征图案的“创新技术”，但在与硅和其他表面的集成方面仍存在许多挑战。

Nanostructures continue to be the focus of intense research because of their fascinating properties that can be distinctly different form their bulk counterparts, and thus show great promise for a range of applications. Complex metallic and organic architectures are emerging as important building blocks for on-chip interconnects and active components in nanoscale electronic, magnetic, photonic, and biosensing devices, for instance. One of the key ingredients required for these future applications is the ability to integrate numerous addressable nanostructures through assembly, patterning, and alignment on technologically relevant solid supports, such as semiconductor surfaces. The challenge lies in fabricating large areas of high density nanostructures, with feature sizes well below 100 nm, in an economically feasible manner. While photolithography will justifiably remain a core technology with respect to the upcoming sub-45 nm generations on the Semiconductor Industry Association (SIA) Roadmap, cost considerations for mass manufacturing will be one critical constraint. As a result, there is interest in the development of complementary patterning strategies that involve large scale self-assembly, for use as a soft organic template for nanostructure development. While block copolymer templating is suggested on the SIA Roadmap to be a potentially "innovative technology" for sub-45 nm feature patterning, there are still many challenges associated with their integration with silicon and other surfaces.