Novel Conductive Adhesives as a Lead-free and Multifunctional Joining Alternative for Electronic Packaging

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As future technological innovations gear towards miniaturizing machines and maximizing performance density, effective joining of similar or dissimilar material components has become one of the most critical technical prerequisites for manufacturing at ever-smaller scales. This project focuses on the joining process in electronics manufacturing where lead-containing soldering technology has been the dominant technology. This conventional soldering technology is being challenged by the increasing demand from consumers for lighter and smaller devices, and the drive to eliminate the use of lead in electronic components due to its toxicity to humans and the environment. In this project, we work with three industrial partners, Celestica, Microbonds and Research In Motion, to develop novel conductive adhesives as a lead-free joining alternative to provide robust bonding and multifunctional properties. To achieve this technology, we have developed new concepts using high aspect-ratio or 1-D nanoscale fillers (nanowires and nanotubes) in conductive adhesives which will not only enhance the mechanical-thermal-electrical properties but also deliver such "smart" functions as self-sensing health monitoring to electronic devices. The cutting-edge research will generate new ideas and knowledge in the joining technology, and, through interactions and collaborations with the industrial sponsors, enable the development of new value-added joining technologies which use flexible, environmentally friendly and cost-effective materials and processes. This development will foster a vital competitive edge for the Canadian electronic industry in the international market place.