Materials, Device, And Interface Engineering for Non-Conventional Electronics by Hard/Soft Material Integration

通过硬/软材料集成实现非常规电子产品的材料、器件和接口工程

• 批准号: 435914-2013
• 负责人: Chung, HyunJoong
• 金额: $ 1.82万
• 依托单位: University of Alberta
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2013
• 资助国家: 加拿大
• 起止时间: 2013-01-01 至 2014-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=533371
• 关键词: Materials; Device; Interface; Engineering; Non

Integrating materials with complementary properties have created new opportunities for producing structural and functional materials. For example, one can achieve mechanical flexibility with high-performance inorganic devices (which are traditionally thought of as brittle) by employing polymeric materials as matrices. The key to achieving this feat lays in carefully integrating micro- and/or nano-sized inorganic device components into a soft material matrix, while maintaining excellent device performance. Novel form factors, such as bendable, foldable, and rollable electronics have been realized through the marriage between hard and soft materials. The current stage of innovative research is on stretchable electronics, where neural interfaces, electronic muscles, and energy harvesters show immense potential. Developing stretchable devices with long-term operational stability is challenging because the electronics must withstand severe strain and volume change during operation. Consequently the major sources of device failure are crack and debonding at the interface between hard and soft materials. The short-term objective of the proposed DG program is to prevent these mechanical failure modes at the interface by controlling the material's morphology and chemistry at the interface. The methodologies come from the disciplines of polymer physics and nanofabrication and are inspired by biology. My research group's long-term goal is to devise conceptually new electronic systems with unprecedented form factors. Independent research on novel soft material matrices as well as micro- and nano-devices will also be performed in parallel. The long-term objective of the DG program is to study various phenomena at the interface between the operating devices and the novel soft material matrix. From a big-picture perspective, the knowledge gained from the DG program will also be applicable to wide range of engineering disciplines such as polymers, composite materials, MEMS, interface science, and bioelectronics. When system-level integration is realized, these non-conventional electronics will serve as novel tools with broad application in fields such as medical therapy, food engineering, and biomedical science.

将具有互补性能的材料整合在一起，为生产结构和功能材料创造了新的机会。例如，人们可以通过使用聚合物材料作为基质，利用高性能的无机设备(传统上被认为是脆性的)来实现机械灵活性。实现这一壮举的关键在于仔细地将微米和/或纳米尺寸的无机器件组件集成到软材料基质中，同时保持优异的器件性能。新的外形因素，如可弯曲、可折叠和可滚动的电子产品，已经通过软硬材料的结合而实现。目前的创新研究阶段是可伸缩电子学，其中神经接口、电子肌肉和能量收集器显示出巨大的潜力。开发具有长期运行稳定性的可伸缩设备是具有挑战性的，因为电子设备必须承受运行过程中的严重应变和体积变化。因此，软硬材料界面处的裂纹和脱粘是导致器件失效的主要原因。拟议的DG计划的短期目标是通过控制界面处的材料形态和化学成分来防止界面处的这些机械失效模式。这些方法来自聚合物物理和纳米制造学科，并受到生物学的启发。我的研究小组的长期目标是设计出具有前所未有的外形尺寸的概念性新电子系统。对新型软材料基质以及微纳器件的独立研究也将并行进行。DG计划的长期目标是研究操作设备和新型软材料基质之间的界面上的各种现象。从宏观的角度来看，从DG项目中获得的知识也将适用于广泛的工程学科，如聚合物、复合材料、MEMS、界面科学和生物电子学。当实现系统级集成时，这些非常规电子将成为一种新型工具，在医疗、食品工程和生物医学等领域有着广泛的应用。