Cold spray heat transfer features used in heat sinks for liquid-Cooling of Computer components

用于计算机组件液体冷却的散热器的冷喷涂传热特性

• 批准号: 476425-2014
• 负责人: Jodoin, Bertrand
• 金额: $ 1.82万
• 依托单位: University of Ottawa
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2014
• 资助国家: 加拿大
• 起止时间: 2014-01-01 至 2015-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=565204
• 关键词: Cold; spray; heat; transfer; features

The latest generation of computer components requires high performance cooling systems due to increased power consumption and restrictions in hardware packaging size. Current air cooling technologies have reached a plateau: greater airflows may be achieved with larger and/or additional fans; however, the added noise and power consumption only leads to marginal improvements in heat removal, mainly because of the limited ability for air to absorb heat. Liquid based cooling of computer components has been slow to develop, despite the prospect of significantly better performance, mainly due to the inherent risk of having liquids in proximity of electronics. As a result, existing liquid-based cooling technologies represents a niche industry, targeted at users of high-end computers who typically want to overclock their machine in order to obtain better performance, whether for complex scientific computational analysis or for serious gaming requiring heavy computational power. However, existing technologies are poorly optimized for pump power, require complex assembly and have been plagued with leaking issues, thus resulting in damage to the computer. Improvements in the design of these liquid based cooling systems should concentrate on optimizing thermal performance for maximum heat removal and ensuring adequate sealing of the liquid loop during operation. Ironside Engineering Inc. is currently developing a novel self-contained closed-loop liquid-based cooling system for use in desktop computers that could offer an innovative solution for improved thermal management of electronics. To optimize thermal performance of the heat transferring components of the circuit, it is proposed to use the Cold Gas Dynamic Spray (CGDS) process to produce three-dimensional heat transfer features such as flow

由于功耗增加和硬件封装尺寸的限制，最新一代的计算机组件需要高性能的冷却系统。目前的空气冷却技术已经达到了一个平台：更大的气流可以通过更大的和/或更多的风扇来实现；然而，增加的噪音和功耗只会导致热量去除的边际改善，主要是因为空气吸收热量的能力有限。计算机部件的液体冷却技术发展缓慢，尽管其性能有显著提高的前景，主要是由于液体靠近电子设备的固有风险。因此，现有的基于液体的冷却技术代表了一个利基行业，针对的是高端计算机的用户，他们通常希望对机器进行超频以获得更好的性能，无论是用于复杂的科学计算分析还是需要大量计算能力的严肃游戏。然而，现有的技术对泵的功率优化得很差，需要复杂的组装，并且一直受到泄漏问题的困扰，从而导致计算机损坏。这些基于液体的冷却系统设计的改进应集中在优化热性能，以最大限度地散热，并确保在运行过程中液体回路的充分密封。Ironside工程公司目前正在开发一种用于台式电脑的新型独立闭环液体冷却系统，该系统可以为改善电子产品的热管理提供创新的解决方案。为了优化电路换热部件的热性能，提出采用冷气动态喷雾（CGDS）工艺产生流动等三维换热特征