Terabit-per-second die-to-die links over low-cost packaging substrates

通过低成本封装基板实现每秒太比特的芯片间链路

• 批准号: 474691-2014
• 负责人: ChanCarusone, Anthony
• 金额: $ 10.41万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=578009
• 关键词: Terabit; per; second; die; links

To enable the continued proliferation of digital connectivity, permeating virtually everything we touch worldwide, this project will advance key technologies for communicating data between two microchips located only millimetres apart. Huawei is a world-leader in the networking equipment that powers our mobile and infrastructure communication networks. Inside that equipment, hundreds of data streams are being communicated and routed between microchips at chips across circuit boards up to a meter in length. A major challenge in these backbone systems is, therefore, communicating broadband data across the circuit boards. Tremendous progress is achievable by locating the chips as closely together as possible. This has recently led to technologies permitting multiple microchip dies to be placed side-by-side onto a common packaging substrate separated by only a few millimetres. To reap the full potential of such package-level integration, the dies must be interconnected with terabit-per-second aggregate bandwidth. Existing solutions to this challenge employ silicon interposers as an advanced packaging substrate, but their high cost is fundamentally prohibitive for high-volume applications. This project will demonstrate key circuit building blocks to enable such links over inexpensive organic packaging substrates. In pursuit of these objectives, this project will provide advanced training for 5 graduate students conferring tremendous benefit upon the Canadian ICT sector.

实现数字连接的持续扩散，几乎渗透到我们接触的一切 在全球范围内，该项目将推进两个微芯片之间的数据通信的关键技术 相距只有几毫米。华为是网络设备领域的世界领先者，为我们的移动和 基础设施通信网络。在该设备内部，数百个数据流 在长度达一米的电路板上的芯片之间进行通信和布线。一位少校 因此，这些主干系统中的挑战是在电路板上传输宽带数据。 通过将芯片尽可能紧密地放置在一起，可以实现巨大的进步。这最近导致了 涉及允许将多个微芯片芯片并排放置在公共封装上的技术 衬底之间只有几毫米的距离。为了充分发挥这种包级集成的潜力， 芯片必须与每秒太比特的聚合带宽互连。应对这一挑战的现有解决方案 使用硅插入器作为先进的封装基板，但其高昂的成本从根本上是令人望而却步的 适用于大容量应用。本项目将演示实现此类链路的关键电路构建块 在廉价的有机包装基板上。为了实现这些目标，该项目将提供 为5000名研究生提供的高级培训为加拿大的信息和通信技术部门带来了巨大的好处。