Scaling chip-to-chip interfaces for next-generation communication equipment

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The modern era is characterized by pervasive connectivity and ambient intelligence, with every device connected to a network. Total network traffic in Canada is slated to double over 2015 levels by 2020 and globally there will be 26.3 billion networked devices in 2020, up from 16.3 billion in 2015. These increasing demands must be satisfied without increasing the cost, complexity and power dissipation of the associated electronics. The 260+ TWh/yr worldwide energy consumption of communication infrastructure continues to grow at a frightening 10.4% annually. The trend is reflected in the evolution of chip-to-chip interface standards, where the specified data rates double every 4 years. Hence, the power consumption and cost of digital input-output (I/O) circuits that shuttle bits between chips threatens to bottleneck overall progress in digital communication unless research progress continues.