Al Electrodeposition to make plated through holes in printed circuit boards using ionic liquids

欧姆尼电路板是一家印刷电路板制造商，位于不列颠哥伦比亚省里士满，成立于 2008年开发用于超导的细线铝线印刷电路板(PCB) 在低(低温)温度下的能力。许多客户对多层版本很感兴趣。这 需要电路板各层之间的电气连接。目前的产品仅限于单层 限制其市场的应用程序。 铝将被电沉积在通孔(PTH)的侧面，该通孔将提供层间电 连通性。需要全铝电气路径，这将要求电镀通孔 全部由铝制成。尝试了许多方法，但都不成功。这项研究 提案将开发一种使用室温熔盐(也称为离子液体-ILS)的新方法。这个 开发的电解液和方法将很容易转移到工业中。最佳条件将是 根据对许多运行参数的系统研究确定的：电流密度、温度、 电解液组成和添加剂的使用等。 用扫描电子显微镜研究了沉积层的形貌和特征 采用扫描电子显微镜(SEM/EDS)、X射线衍射仪(X射线衍射仪)和光学显微镜(OM)等方法对样品进行了分析 最佳工艺条件。最终目标是在金属表面电沉积致密、光亮、附着力强的铝层。 为了确保多氯联苯电层和电介质层之间的电连接，必须在多氯联苯的侧面进行保护。

Omni Circuit Boards is a Printed Circuit Board manufacturer located in Richmond, BC which began development of a fine-line aluminum trace printed circuit board (PCB) in 2008 for its superconductive capabilities at low (cryogenic) temperature. Multi-layer versions are of interest to many customers. This requires electrical connectivity between layers of the PCB. The current product is limited to single layer applications which limits its market. Al will be electrodeposited on the sides of the through holes (PTHs) which will provide the interlayer electrical connectivity. The all-aluminum electrical path is required which would demand the plated through hole be constructed entirely of aluminum. Many methods were attempted, but none were successful. This research proposal will develop a new method using room temperature molten salts (also called ionic liquids-ILs). The electrolyte and methods developed will be easily transferred to industry. The optimum conditions will be determined based on systematic studies of the many operating parameters: current density, temperature, electrolyte composition and use of additives etc. The morphology and characteristics of the deposited layer will be investigated using scanning electron microscopy (SEM/EDS), X-Ray Diffraction (XRD) and optical microscopy (OM) so as to determine the optimum process conditions. The ultimate goal is to electrodeposit dense, bright and adherent Al layers on the sides of of PTHs, so as to ensure electrical connections between the electric and dielectric layers of PCBs.