Nanoscale Direct-Write Machining using Focused Ion Beams

使用聚焦离子束进行纳米级直写加工

• 批准号: 522094-2018
• 负责人: Bassim, Nabil
• 金额: $ 1.78万
• 依托单位: McMaster University
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2018
• 资助国家: 加拿大
• 起止时间: 2018-01-01 至 2019-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=644760
• 关键词: Nanoscale; Direct; Write; Machining; using

Focused Ion Beams are powerful tools for machining materials at the nanoscale with high resolution. This study proposes to**compare tradition FIB direct-write patterning using gallium beams to newer ion sources such as xenon, helium and neon.**Understanding how these mill is a series of benchmark performance studies, on important samples such as silicon, polycrystalline**Al, Ni and Ze, and III-V semiconductors help creates data that allows further optimization of FIB microscopes. By comparing**milling features as a function of beam parameters, such as beam voltage and current, we can compare this information to existing**simulations of ion-solid interactions and then prescribe a method to optimize nanomachining for higher resolution, maximum**material removal rate, or minimal beam damage.

聚焦离子束是加工纳米级高分辨率材料的强大工具。这项研究建议 ** 将传统的FIB直接写入图案化使用镓束与较新的离子源，如氙，氦和氖进行比较。了解这些轧机是如何进行一系列基准性能研究的，对硅、多晶 **Al、Ni和Ze以及III-V族半导体等重要样品的研究有助于创建数据，从而进一步优化FIB显微镜。通过比较 ** 铣削功能作为光束参数的函数，如光束电压和电流，我们可以将此信息与离子-固体相互作用的现有 ** 模拟进行比较，然后规定一种方法来优化纳米加工，以获得更高的分辨率，最大的材料去除率或最小的光束损伤。