Novel scanning, milling and data handling strategies for circuit analysis********

用于电路分析的新颖扫描、铣削和数据处理策略********

• 批准号: 531491-2018
• 负责人: Bassim, Nabil
• 金额: $ 4.92万
• 依托单位: McMaster University
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2018
• 资助国家: 加拿大
• 起止时间: 2018-01-01 至 2019-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=644762
• 关键词: Novel; scanning; milling; data; handling

Computer chip manufacturing companies use high resolution electron microscopes to scan a chip and high-powered ion beams to remove material (dig under the surface), expose buried features, and thereby determine whether other companies are copying their chips and infringing upon their intellectual property. **As computer chips get more powerful, they also shrink, making it harder to detect tinier and tinier features. The microscopes have to get better just as the computer chips get better. But, as the microscopes look at smaller and smaller features, scanning the chips becomes excessively time consuming.**In this project, we will use computer programs and automation to help us speed up the microscopes' scanning of the chips in order to save time and money. This requires a better understanding of the way the electron beam interacts with the sample. It also requires figuring out how to calculate the fastest time to scan a chip and using computer programs to accurately estimate the missing information. There are a number of mathematical methods to do this. **Furthermore, we will try to understand how the ions dig into the sample so that we can expose 3-dimensional information using a new type of ion microscope, the plasma focused ion beam. This will be the first time a plasma FIB has been used to remove the packaging from computer chips and we will figure out if this approach can work.****

计算机芯片制造公司使用高分辨率电子显微镜扫描芯片，并使用高功率离子束去除材料(在表面下挖掘)，暴露隐藏的特征，从而确定其他公司是否在复制他们的芯片并侵犯他们的知识产权。*随着计算机芯片变得更强大，它们也会缩小，从而更难检测到更微小的特征。显微镜必须变得更好，就像计算机芯片变得更好一样。但是，随着显微镜观察越来越小的特征，扫描芯片变得过于耗时。**在这个项目中，我们将使用计算机程序和自动化来帮助我们加快显微镜扫描芯片的速度，以节省时间和金钱。这需要更好地了解电子束与样品相互作用的方式。它还需要找出如何计算扫描芯片的最快时间，并使用计算机程序准确估计丢失的信息。有许多数学方法可以做到这一点。**此外，我们将试图了解离子是如何挖掘到样品中的，以便我们可以使用一种新型的离子显微镜--等离子体聚焦离子束--来曝光三维信息。这将是第一次使用等离子FIB来去除计算机芯片上的封装，我们将研究这种方法是否可行。*