Design for Testability and Hardware Security

新一代集成电路包括高性能模拟和数字模块、处理单元、存储器和传感器。虽然这些新的微芯片为显著提高便携式设备的性能提供了机会，但它们也带来了新的挑战。开发先进集成电路的制造测试，同时确保其硬件安全是一项艰巨的任务。在开发各种微芯片测试方法方面已经取得了很大的进展。高效的可测性设计(DFT)技术，如扫描和内建自测试(BIST)，被广泛用于对数字电路进行测试。然而，DFT方法的制定没有充分考虑到安全问题。例如，扫描链插入是最有效的DFT技术之一，可以用来访问芯片内部的关键信息。对可测试性和硬件安全性的要求形成了鲜明的对比。为了测试芯片，需要访问内部电路以将测试向量施加到所需的子电路并观察它们的响应。虽然这种完全访问被认为是制造测试的理想选择，但很明显，这种对设备内部电路的不受限制的访问可能会破坏其安全性。几十年来，硬件被认为是信任和安全的来源，但由于外包，这种假设不再正确。一条生产线的成本如此之高，以至于只有少数几家公司有能力拥有一条内部生产线。将内部制造外包给海外铸造厂为恶意活动提供了机会，并为所谓的硬件特洛伊木马程序的潜在安全威胁铺平了道路。必须修改当前的可测试性解决方案，以检测不需要的硬件修改，并使用测试基础设施防止安全漏洞。 这项工作的主要目标是推进新一代集成电路的可测性设计和安全技术，以确保可测试性和硬件安全性，同时降低总体制造成本。这项研究建议的具体目的是： (A)开发一种使用基于RFID的认证的3D IC的安全可测试性设计方法。 (B)实施检测硬件特洛伊木马的测试技术。 (C)开发3D堆叠IC的预键合测试解决方案。 (D)建立基于FinFET的电路的故障模型。

The new generation of integrated circuits include high performance analog and digital blocks, processing units, memories, and sensors. While such new microchips provide opportunities to enhance the performance of portable devices significantly, they also pose new challenges. Developing manufacturing tests for advanced integrated circuits while ensuring their hardware security is a formidable task. A great deal of progress has been made in developing various test methodologies for microchips. Efficient Design-for-Testability (DFT) techniques such as scan and Built-in Self-Test (BIST) are widely used to carry out tests on digital circuits. However, the DFT methodologies have been developed without adequate attention to security implications. For instance scan-chain insertion, one of the most effective DFT techniques, can be utilized to access the critical information inside a chip. The requirements for testability and hardware security are in sharp contrast with one another. To test a chip, access to the internal circuits are needed to apply test vectors to desired sub-circuits and observe their responses. While such full access is considered ideal for manufacturing tests, it is clear that such unrestricted access to the internal circuits of a device can undermine its security. For decades, hardware was assumed to be the source of trust-and-security but this assumption is not true anymore due to outsourcing. The costs of a fabrication line are so high that only a few companies can afford to have an in-house fabrication line. The outsourcing of in-house fabrication to overseas foundries provides opportunities for malicious activities and paves the way for potential security threats known as hardware Trojans. The current solutions for testability have to be modified to detect undesired hardware modifications and prevent security breaches using the test infrastructure. The main objective of this work is to advance the design-for-testability and security techniques for the new generation of integrated circuits to ensure both testability and hardware security while reducing the overall manufacturing costs. The specific aims of this research proposal are to: (a) Develop a Design for Secure Testability Method for 3D ICs using an RFID based Authentication. (b) Implement a Test Technique to Detect Hardware Trojans. (c) Develop a Pre-bond Test Solution for 3D Stacked ICs. (d) Develop a Fault Model for FinFET Based Circuits.