Dicing saw for optoelectronics and sensors

我们需要一种高速、高精度的自动切割锯，能够精密切割半导体晶片，并能将微米级结构精密铣削到各种基板上。具有这两种能力的切割锯是任何需要芯片切割、高精确子单元或精密功能的研究小组的基本加工工具，例如片上光子光源和波导、第三代光伏设备、非线性光学系统或生物传感器。它是一种必不可少的加工设备，用于各种应用的设备准备和后处理。虽然本提案的所有共同申请者(Turak、Xu、Bradley、Knight、Soleymani)都将使用拟议的设备，但他们将把它应用于广泛的尖端行业，分为三类：集成光子学和通信的材料和器件、生物兼容传感和监测以及变革性光伏。该工具将安装在麦克马斯特新兴设备技术中心(CEDT)内，该中心是专门开发材料、设备、系统和处理协议的核心研究机构。这也将使麦克马斯特和当地附近的许多(&gt；20)小组可以临时获得它，他们是该中心的用户成员。缺乏可靠的切粒设备极大地限制了共同申请者在具有国际竞争力的研究领域内及时发表论文的能力。有了这样的工具，联合申请者将能够推动高性能激光的能力，改善用于超高速通信的光纤芯片耦合，使手持生物传感器微型化，并改造第三代光伏。

We request a high-speed, high accuracy automatic dicing saw, capable of precision cutting of semiconductor wafers, and precision milling of micron scale structures into various substrates. A dicing saw with these two capabilities is a fundamental processing tool for any research group requiring chip dicing, high precision sub-units, or precise features, such as on-chip photonic sources and waveguides, 3rd generation photovoltaic devices, nonlinear optical systems or biosensors. It is an essential piece of processing equipment, used for both device preparation and post-processing for a wide variety of applications. While all the co-applicants in this proposal (Turak, Xu, Bradley, Knights, Soleymani) will utilize the proposed equipment, they will apply it to a broad variety of cutting edge sectors, grouped into three categories: Materials and Devices for Integrated Photonics and Communications, Bio-compatible Sensing and Monitoring; and Transformative Photovoltaics. This tool will be housed within the McMaster Centre for Emerging Device Technology (CEDT), a core research facility specializing in the development of materials, devices, systems and processing protocols. This will also make it available to numerous (>20) groups at McMaster and in the local vicinity, who are user members of the Centre, on an ad hoc basis. The lack of reliable access to the dicing equipment has drastically limited the ability of the co-applicants to publish in a timely manner within internationally competitive areas of research. With such a tool, the co-applicants will be able to push the capabilities of high performance lasers, improve optical chip-fiber coupling for ultra-fast communications, miniaturize hand-held biosensors, and transform third generation photovoltaics.