Dicing saw for optoelectronics and sensors

我们要求一种高速、高精度的自动切割锯，能够精密切割半导体晶片，并将微米级结构精密铣削成各种基板。具有这两种功能的切割锯是任何需要芯片切割、高精度子单元或精确特征的研究组的基本加工工具，例如片上光子源和波导、第三代光伏器件、非线性光学系统或生物传感器。它是加工设备中必不可少的一部分，用于各种应用的器件制备和后处理。虽然该提案中的所有共同申请人（Turak，Xu，布拉德利，Knights，Soleymani）都将使用拟议的设备，但他们将把它应用于各种尖端领域，分为三类：集成光子学和通信的材料和设备，生物相容性传感和监测;以及变革性光子学。该工具将被安置在麦克马斯特新兴设备技术中心（CEDT）内，这是一个专门开发材料，设备，系统和处理协议的核心研究机构。这也将使麦克马斯特和当地邻近地区的许多（超过20个）团体能够临时使用该中心的用户。缺乏对切割设备的可靠访问极大地限制了共同申请人在具有国际竞争力的研究领域内及时发表的能力。有了这样的工具，共同申请人将能够推动高性能激光器的能力，改善超高速通信的光学芯片-光纤耦合，简化手持生物传感器，并改变第三代光电子学。

We request a high-speed, high accuracy automatic dicing saw, capable of precision cutting of semiconductor wafers, and precision milling of micron scale structures into various substrates. A dicing saw with these two capabilities is a fundamental processing tool for any research group requiring chip dicing, high precision sub-units, or precise features, such as on-chip photonic sources and waveguides, 3rd generation photovoltaic devices, nonlinear optical systems or biosensors. It is an essential piece of processing equipment, used for both device preparation and post-processing for a wide variety of applications. While all the co-applicants in this proposal (Turak, Xu, Bradley, Knights, Soleymani) will utilize the proposed equipment, they will apply it to a broad variety of cutting edge sectors, grouped into three categories: Materials and Devices for Integrated Photonics and Communications, Bio-compatible Sensing and Monitoring; and Transformative Photovoltaics. This tool will be housed within the McMaster Centre for Emerging Device Technology (CEDT), a core research facility specializing in the development of materials, devices, systems and processing protocols. This will also make it available to numerous (>20) groups at McMaster and in the local vicinity, who are user members of the Centre, on an ad hoc basis. The lack of reliable access to the dicing equipment has drastically limited the ability of the co-applicants to publish in a timely manner within internationally competitive areas of research. With such a tool, the co-applicants will be able to push the capabilities of high performance lasers, improve optical chip-fiber coupling for ultra-fast communications, miniaturize hand-held biosensors, and transform third generation photovoltaics.