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Integrated Circuits for Large Arrays

Integrated Circuits for Large Arrays
大型阵列集成电路
批准号:
RGPIN-2020-06239
负责人:
Shekhar, Sudip
金额:
$2.4万
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2022
资助国家:
加拿大
项目状态:
已结题
起止时间:
2022-01-01 至 2023-12-31

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中文摘要
翻译
计算和数据通信已经改变了我们工作、交流、社交、学习和教育的方式。为了改善生计和解决人类社会面临的大多数具有挑战性的问题,我们需要无线连接、计算和数据中心,这些中心可以在可持续的电力消耗下处理大量数据。随着互补金属氧化物半导体(CMOS)技术由于物理和经济上的限制而呈指数级扩展,多核和互联的数据处理和通信已经兴起。5G蜂窝系统目前采用了10-100个天线阵列,称为大规模MIMO(多输入多输出),以促进通信和计算系统所需的数据吞吐量。此外,下一代架构预计将使用数百到数千个超大天线阵列,以满足预计的高速连接需求。这些硬件系统的设计面临着极大的挑战,100-1000个这样的天线需要同步,并能够以精确的角度引导信号(波束形成)。我们的研究将寻求设计电路和系统来解决这样一个网络中的两个关键问题:(1)低功耗天线元件之间的高频时钟产生,分配和同步;(2)精确波束形成。移动大量数据的类似需求也出现了,以促进大型机器学习计算任务,导致采用多个加速器芯片,称为小芯片,相互连接。由于许多机器学习任务依赖于数据密集型的深度神经网络,未来将设想大量的小芯片来执行这些苛刻的任务。除了处理元素执行的数据处理之外,在如此大的数组中处理数据移动的互连将消耗大量的功率,甚至作为许多任务的显示停止器。本研究计划将寻求设计电路和系统来解决大型芯片阵列之间的互连挑战:(1)在没有电力开销的情况下,将短距离电缆链路上的数据吞吐量提高一倍;(2)降低硅光子学链路的功耗,使光学器件更接近计算芯片。申请人之前的发现拨款为这些目标在器件和电路层面奠定了基础。该方案旨在显著降低功耗和提高吞吐量,以实现大型阵列。加拿大是无线通信和机器学习研究的温床。确保我们在硬件研发方面保持领先地位,以支持下一代蜂窝系统和机器学习加速,这将为高价值的工作、技术和创业铺平道路。
英文摘要
Computing and data communications have changed the way we work, communicate, socialize, learn, and educate. To improve livelihoods and to solve most of the challenging problems humans face as a society, we need wireless connectivity, computing, and data-centers that can process massive amounts of data with sustainable power consumption. With the exponential scaling of complementary metal-oxide-semiconductor (CMOS) technology coming to an end due to physical and economic limitations in manufacturing, multi-core and inter-linked data processing and communication have risen to the fore. 5G cellular systems have currently adopted 10-100 of antenna arrays, called Massive MIMO (Multiple-Input Multiple-Output), to facilitate the data throughput demanded by communications and computing systems. Furthermore, the next-generation architecture is predicting the use of extremely-large antenna arrays, in hundreds to thousands, to meet the projected demand for high-speed connectivity. The design of these hardware systems has extremely large challenges, with 100-1000 of such antennas requiring synchronization and an ability to steer the signal with precise angles (beamforming). Our research will seek to design circuits and systems to solve two critical problems in such a network: (1) high-frequency clock generation, distribution, and synchronization between the antenna elements with low-power consumption; and (2) precise beamforming. A similar need to move a massive amount of data is also arising to facilitate large machine learning computing tasks, leading to the adoption of multiple accelerator chips, called chiplets, interconnected to each other. With many machine learning tasks relying on data-intensive deep neural networks, large arrays of chiplets are being envisioned to carry out such demanding tasks in the future. Beyond the data crunching carried out by the processing elements, a large amount of power will be consumed by interconnects handling the data movement in such large arrays, even acting as a show-stopper for many tasks. This research proposal will seek to design circuits and systems to solve the interconnect challenge between the large arrays of chiplets: (1) doubling the data throughput on the short-reach electrical wireline links without power overhead; and (2) reducing the power consumption of silicon photonics link so as to bring optics closer to the compute chiplets. The applicant's previous discovery grant laid the foundation for these objectives at the devices and circuits level. This proposal aims for significant power consumption reduction and throughput increase to realize large arrays. Canada is a hotbed for research in wireless communications and machine learning. Ensuring that we also remain ahead in the hardware research and development to support the next generation of cellular systems and machine learning acceleration will pave the way for highly valued jobs, technologies, and startups.
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Advanced-modulation circuits for low-power scalable wireline transceivers
  • 批准号:
    543951-2019
  • 项目类别:
    Collaborative Research and Development Grants
  • 资助金额:
    $3.39万
  • 财政年份:
    2021
  • 负责人:
    Shekhar, Sudip
  • 依托单位:
Electronic-photonic integrated circuits for on-chip optical isolation
  • 批准号:
    539204-2019
  • 项目类别:
    Collaborative Research and Development Grants
  • 资助金额:
    $6.8万
  • 财政年份:
    2021
  • 负责人:
    Shekhar, Sudip
  • 依托单位:
Infrastructure for silicon photonic test and development
  • 批准号:
    RTI-2022-00723
  • 项目类别:
    Research Tools and Instruments
  • 资助金额:
    $10.93万
  • 财政年份:
    2021
  • 负责人:
    Shekhar, Sudip
  • 依托单位:
Integrated Circuits for Large Arrays
  • 批准号:
    RGPIN-2020-06239
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.4万
  • 财政年份:
    2021
  • 负责人:
    Shekhar, Sudip
  • 依托单位:
海外基金