Advanced Cooling Technologies for Microsystems

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The goal of the proposed project is to create innovative high-performance solutions for the cooling of high power electronic components, by continuing the development of a highly efficient research partnership with Systemex Energies and East-West Manufacturing. The outcomes of the proposed project will comprise reliable technologies that are compatible with modern manufacturing infrastructures and that provide an economical path to meeting the growing demand for energy-efficient data centers and for very high power microprocessors. The principal new concepts in the proposed research are to use a new electroplated porous copper coating in low-pressure closed thermosiphons to achieve state-of-the-art performance in air-cooled microprocessors. The proposed research will thus fill knowledge gaps on the reliability, design methodologies and proper manufacturing techniques of these thermosiphons, as well as gaps on flows in microfabricated devices used to optimize energy management.