基于新一代高温功率芯片封装的Ni-Sn TLPS连接特性与动力学研究

研究内容和意义：瞬时液相烧结（TLPS）连接是近年来电子封装领域发展起来的一种新的连接技术，具有连接压力小、连接温度低、接头耐温高、适应性好等特点。本项目拟针对新一代高温功率芯片封装"低温连接/高温服役" 的需求，以Ni-Sn为反应系进行TLPS连接，开展Ni-Sn TLPS连接的相关基础研究。包括"Ni-Sn TLPS连接特性"--连接界面结构特征、界面反应及连接性能等和"Ni-Sn TLPS连接过程动力学"--连接层等温凝固/化合物转变动力学表征、动力学模型及动力学方程等。项目研究成果对探索新一代高温功率芯片封装高性能连接技术（材料及工艺）具有重要意义。 特色与创新：Ni-Sn TLPS连接具有液相量大、连接特性好、耐温高等特点，国内外尚未见研究报道；项目拟建立的连接层等温凝固/化合物转变同心球动力学模型和相关动力学表征/分析方法对同领域研究具有普遍意义。

As a new technique developed in recent years, transient liquid phase sintering bonding (TLPS Bonding) exhibits a number of advantages, such as low bonding pressure and temperature, excellent resistance to high temperature, strong adaptability and so on. Furthermore, Ni-Sn TLPS bonding using Ni-Sn as reactive filler material possesses more liquid phase, better bonding characteristics and resistance to high temperature. In accordance with the demands of high-temperature power device packaging, this project aims to carry out the relative basic research on Ni-Sn TLPS bonding with Ni-Sn system as reactive filler material. Two basic problems will be investigated: one is the TLPS bonding characteristics including the bonding interface structure, interfacial reaction and bonding properties, the other is the bonding process kinetics, such as the characterization of compound transition during isothermal solidification, the kinetic model and its equation. The study of this project would be significant for exploring high performance bonding technology (materials and processes) of high-temperature power device packaging.