Fundamental Studies of Radiofrequency Gas Discharges for Plasma Processing

等离子体蚀刻的基本原理通常不被理解，因为许多不同的过程同时发生，包括大量的电相互作用。本研究将使用强大的诊断资源（发射光谱，荧光，光电方法）来阐明负电荷，射频放电几何形状和操作变量的作用。有了这些知识，它将成为实用的设计预测，定量的方法，用于开发新的等离子体工艺。

The fundamentals of plasma etching are not understood in general, as so many different processes occur simultaneously, including substantial electrical interactions. This study will use powerful diagnostics resources (spectroscopy of emission, fluorescence, optogalvanic methods) to elucidate the role of negative charges, of the rf discharge geometry and of the operating variables. With such knowledge, it will become practical to devise predictive, quantitative methods for use in the development of new plasma processes.