Small Grants for Exploratory Research: Helical Drill Point Grinder

这一努力是为了探索井眼质量的改善， 印刷电路板用微型钻头的钻头寿命 制造业，通过利用螺旋点上的 钻而不是目前使用的平面点。 一种新的描述微平面螺旋点的几何模型 - 将开发钻头。 基于该模型， 设计并制造了一种用于磨削螺旋尖的机构 微型钻头 螺旋尖的可用性 微型训练对于探索性能的改进至关重要 和生命似乎 理论上可行。 这种可行性是基于这样一个事实， 螺旋点提供更高的间隙角分布 沿着钻头的切削刃，而不削弱刃， 与平面尖钻相比。 这项工作，只处理微钻组合 随着印刷电路板行业的大规模发展， 它对电子工业的战略重要性， 这是一个高风险的企业，具有巨大的潜力， 收益

This effort is to explore the improvements in hole quality and drill life of micro-drills used in the printed circuit board manufacturing industry, by the utilization of helical points on the drills rather than planar points that are currently utilized. A new geometrical model that describes a helical point on a micro -drill will be developed. Based on this model a kinematic mechanism will be designed and fabricated to grind helical points on micro-drills. The availability of helically-pointed micro-drills is essential to explore improvements in performance and life that appear to be theoretically feasible. This feasibility is based on the fact that helical points offer a much higher clearance angle distribution along the drill's cutting edge, without weakening the edge, in comparison to planar pointed drills. This effort that deals only with micro-drills in combination with the large dollar volume of the printed circuit board industry and it's strategic importance to the electronic industry, makes this a high risk venture with a significant potential for large pay-offs.