Technology and Curriculum Development for Packaging Optoelectronic Parallel Computing Systems Based on Free-Space Optical Interconnects

该奖项为390，000美元，用于开发光电技术 包装科学技术及相关课程。 这是一 电气工程和计算机工程之间的共同努力 美国加州大学圣地亚哥分校 科罗拉多大学机械工程系， 巨石 联合努力将解决对齐，组装， 封装光电并行计算的若干问题 系统，利用现有的优势， 机构职能体系 这两项互补的研究工作--在一个 推动美国经济竞争力的关键领域将是 通过课程纳入教育计划 发展 现有的课程将被修改，新的课程 将增加新的研究成果，以加快转移到 教室

This award, of $390,000, is for the development of optoelectronic packaging science technology and related curriculum. This is a joint effort between the Electrical and Computer Engineering Department at the University of California, San Diego and the Mechanical Engineering Department at the University of Colorado at Boulder. The joint effort will address the alignment, assembly, and CAD issues of packaging optoelectronic parallel computing systems, using leverage from the existing strengths of both institutions. The two complementary research efforts -- in a critical area driving U.S. economic competitiveness -- will be integrated into an educational program by means of curriculum development. Existing courses will be modified and new courses will be added to expedite transferring new research results to the classrooms.