Dry Plating Apparatus and Process Development

紧固件电镀会产生大量的固体和液体废物。为了解决这一问题，已经开发了一种独特的干镀方法。这种方法消除了液体化学物质，最大限度地减少了固体废物。已成功地建立了一个工艺模型，该模型可以预测独立工艺变量对沉积速率和晶粒度的累积影响。所产生的数据表明，干法电镀是一种很有前途的、安全的电镀替代方法。将开发一种适用于电镀紧固件的镉干镀设备，并对该工艺的环境和职业安全标准进行调查。为了研究紧固件行业所需涂层的质量，将开发和模拟干法电镀工艺。如果能够以环境安全的方式获得这种质量，干法电镀就有很大的潜力电镀大量紧固件。

Electroplating of fasteners generates large amounts of solid and liquid waste. A unique dry plating method has been developed to address this concern. This method eliminates liquid chemicals and minimizes solid waste. A process model has been successfully developed that predicts the cumulative effect of independent process variables on the deposition rate and the grain size. The data generated has indicated that the dry plating is a promising and safe alternative to electrochemical plating. A cadmium dry plating apparatus suitable for plating fasteners will be developed and the environmental and occupational safety standards of this process will be investigated. The dry plating process will be developed and modeled to study the quality of the coatings which are needed in the fastener industry. If this quality can be obtained in an environmentally safe manner, the dry plating has a substantial potential for plating large quantities of fasteners.