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Packaging of Microelectronic Devices: Short Courses for Undergraduate Faculty Enhancement

Packaging of Microelectronic Devices: Short Courses for Undergraduate Faculty Enhancement
微电子器件封装:本科师资能力提升短期课程
批准号:
9653375
负责人:
Guna Selvaduray
金额:
$9.97万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1997
资助国家:
美国
项目状态:
已结题
起止时间:
1997-01-15 至 1999-12-31

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中文摘要
翻译
四个为期一周的微电子封装短期课程将在一年级和二年级的6月和7月提供,为期两年。微电子封装是封装半导体器件的技术,是一个跨学科领域,需要几个传统工程和科学学科的知识。这门短期课程的主题将会引起电气、机械、材料和工业工程专业的教师的兴趣。实验练习将是课程的主要组成部分,它将强调多学科的包装设计、长期可靠性和制造操作。对当地硅谷行业的实地考察将加强学习过程。将提供一些例子,说明如何将短期课程材料融入现有课程。将为参与者提供后续支持,以协助他们在本国机构介绍这些概念。将通过问卷调查和直接电子邮件联系,持续监测这一情况。将汇编面临的问题、制定的解决办法--特别是创新的办法--制定新的实验室练习以及其他相关信息,并以定期通讯的形式分发给所有与会者。上海州立大学工程学院将作为这些材料的保管所。将编写一份《微电子封装实验室练习》手册并提供给学员。这也将提供给其他感兴趣的大学教职员工。一名独立评估员将由参与者进行、汇编和分发课程评估。
英文摘要
Four one-week long short courses on Microelectronic Packaging will be offered over a two year period, in June and July, during Years I and II. Microelectronic packaging, which is the technology of encapsulating semiconductor devices, is an interdisciplinary field which requires knowledge from several traditional engineering and science disciplines. The subject matter of the short course will be of interest to faculty in electrical, mechanical, materials and industrial engineering. Hands-on laboratory exercises will be a major component of the course, which will emphasize multi-disciplinary package design, long term reliability and manufacturing operations. A field trip to a local Silicon Valley industry will enhance the learning process. Examples of how the short course material can be integrated into existing curricula will be provided. Follow through support will be provided for participants to assist them in introducing these concepts at their home institutions. This will be monitored on an on-going basis, via questionnaires and direct email contact. Problems faced, solutions developed - especially innovative ones - new laboratory exercises developed, and other pertinent information will be compiled and distributed to all participants in the form of a periodic newsletter. SJSU's College of Engineering will serve as a depository for this material. A manual on "Laboratory Exercises in Microelectronic Packaging" will be prepared and provided to participants. This will also be made available to other interested university faculty. An independent evaluator will conduct, compile and distribute course evaluations by participants.
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Hazardous Materials Incidents During Earthquakes: Japan's Experience and Solutions
  • 批准号:
    9301005
  • 项目类别:
    Standard Grant
  • 资助金额:
    $11.89万
  • 财政年份:
    1993
  • 负责人:
    Guna Selvaduray
  • 依托单位:
Laboratory Development in Engineering Ceramics
  • 批准号:
    9050497
  • 项目类别:
    Standard Grant
  • 资助金额:
    $0.0万
  • 财政年份:
    1990
  • 负责人:
    Guna Selvaduray
  • 依托单位:
海外基金