Workshop on Thermal Aspects of Manufacturing and Materials Processing: Emerging Technologies and Research Issues

该奖项将部分支持一个关于“制造和材料加工的热方面”的研讨会。研讨会的目的是汇集在新兴技术领域的知识渊博的人士和对热加工有浓厚兴趣的研究人员，交换信息并探索共同的技术领域。讲习班旨在吸引工业界和学术界的参与。它将与1998年国际机械工程大会和博览会（将在加利福尼亚州的阿纳海姆举行）一起举行，为期两天，届时将包括来自工业和联邦实验室的代表所做的最新技术，未来趋势和关键热问题的介绍，以及所有与会者随后的讨论。主题范围从电子产品的化学气相沉积到模型可靠性的性能测量，包括陶瓷，激光，等离子体，聚合物和热加工，MEMS，纳米结构和原位测量。将编写一份印刷版报告，分发给政府机构和工业界，并编写以网络为基础的报告，供学术界和其他人士以电子方式查阅。

Abstract Prasad, V. The award is to partially support a workshop on "Thermal Aspects of Manufacturing and Materials Processing." The objective of the workshop is to bring together a cross section of people knowledgeable in areas of emerging technology and researchers with a strong interest in thermal processing to exchange information and to explore common technical areas. The workshop is directed towards industrial and academic participation. It will take place over two days in conjunction with the 1998 International Mechanical Engineering Congress and Exposition (to be held at Anaheim, California) and will involve presentations of current state-of-the-art, future trends, and critical thermal issues made by representatives from industry and federal laboratories and subsequent discussion by all attendees. The topics range from chemical vapor deposition for electronics to property measurements for model reliability and includes ceramic, laser, plasma, polymer and thermal processing, MEMS, nanostructures, and in-situ measurements. A printed report will be prepared for dissemination to government agencies and industry and web based version will be prepared for electronic access by academics and others.