SGER: Precision Wire Saw Machining of Ceramic Materials

这个小型探索性研究基金(SGER)的目标是研究非导电陶瓷材料的精密金刚石绳锯加工。线锯加工技术已经被开发出来，将大直径的硅或碳化硅钢锭切割成薄晶片。最近开发出了直径小于0.2 mm的细小、固定研磨的摇摆运动金刚石绳索和绳锯机。这种新型的金刚石丝不仅提高了线锯加工中的材料去除速度，而且将加工材料的种类从只有硅、碳化硅、氧化锆，扩展到其他非导电陶瓷材料。本项目计划购买一台实验室摆动绳锯机，以研究绳锯加工的机理，并研究五个主要工艺参数对晶片翘曲和厚度变化的影响。这些参数是：(1)钢丝速度，(2)钢丝向前/向后运动，(3)冷却液，(4)钢丝直径和直径变化，以及(5)部分进料速度。本项目还将对两轴和四轴等值线切割进行探索。类似于导电材料的电火花线切割加工，金刚石线锯加工可以为加工复杂形状的非导电材料提供灵活且经济有效的方法。由于硅、碳化硅和氧化锆这三种目标材料对红外信号都是半透明的，因此将进行红外摄像机穿透工件温度测量的实验，该研究项目的成功将有助于更好地了解固定磨料金刚石线锯的加工过程。这项研究的结果还可以将线锯加工工艺的使用扩展到广泛的非导电先进工程材料，并产生更复杂的形状。

The goal of this Small Grant for Exploratory Research (SGER) is to study the precision diamond wire saw machining of non-electrically conductive ceramic materials. Wire saw machining technologies have been developed to slice large diameter Si or SiC ingots into thin wafers. The thin, less than 0.2 mm in diameter, fixed-abrasive diamond wires and wire saw machines with rocking motion have recently been developed. This new type of diamond wire has not only improved the material removal rate in wire saw machining but also expanded the types of work-material from just Si, SiC, zirconia, to other non-electrically conductive ceramic materials. This project proposes to acquire a laboratory rocking-motion wire saw machine to study the mechanics of wire saw machining and to investigate effects of five major process parameters on wafer warp and thickness variation. These parameters are: (1) wire speed, (2) forward/backward wire motion, (3) coolant, (4) wire diameter and diameter variation, and (5) part infeed rate. Two- and four-axis contour wire sawing will also be explored in this project. Similar to the wire EDM process for electrically conductive materials, the diamond wire saw machining could provide flexible and cost-effective methods to machine complicated shapes for non-electrically conductive materials. Since the three targeted work-materials, Si, SiC, and zirconia, are all semi-transparent to the infrared signal, a through-the-workpiece temperature measurement using the infrared video camera will be experimented.Success in this research project will lead to a better understanding of the fixed-abrasive diamond wire saw machining process. Results of this research could also expand the use of wire saw machining processes to a wide-range of non-electrically conductive, advanced engineering materials and to generate morecomplicated shapes.