Optoelectronic Devices, Interconnects, and Packaging (COEDIP Center)

亚利桑那大学和马里兰大学正在提议更新他们成功的联合产业/大学合作研究中心(I/UCRC)，该中心由国家科学基金会赞助，题为“光电设备互连和封装中心(COEDIP)”。该中心成立于五年前，旨在基于两校在光电子元件、封装和互联领域的优势，促进两所大学和行业之间的合作研究。该中心的主要目标是：-促进两所大学之间的合作和联合项目；-将两所大学开发的新技术转移给其产业合作伙伴；以及-培养高素质的学生，促进他们与产业的互动。

The University of Arizona and the University of Maryland are proposing the renewal of their successful joint Industry/University Cooperative Research Centers (I/UCRC), entitled "The Center for Optoelectronic Devices Interconnect and Packaging (COEDIP)" under the sponsorship of the National Science Foundation. The Center was created five years ago to promote collaborative research between the two Universities and industries based on their strengths in the field of optoelectronics components, packaging and interconnection. The major goals of the Center are:- To promote collaboration and joint projects between the two universities;- To transfer new technology developed within each university to their industrial partners; and- To train highly qualified students and promote their interaction with industries.