Advanced MEMS Sensors for Civil Engineering

此次行动是为探索性研究（SGER）提供小额赠款，以支持购买最先进的MEMS（微机电系统）传感器系统，并将其集成到实时自然灾害监测系统中。MEMS是通过利用微加工技术将机械元件、传感器、致动器和电子器件集成在共同的硅衬底上。当电子器件使用集成电路（IC）工艺序列制造时，微机械部件使用兼容的“微加工”工艺制造，选择性地蚀刻硅片的部分或添加新的结构层以形成机械和机电设备。该机会是购买由集成微仪器公司（IMI）开发的MEMS高保真数字加速度计的原型运行，IMI是一家小型初创公司，根据DARPA（国防高级研究计划局）和AFOSR（空军科学研究办公室）的研究合同开发MEMS设备。该器件在单芯片封装中提供了一个非常线性，敏感和坚固的三维加速度计。由于输出数据流在芯片内部数字化，因此没有随之而来的信号处理问题或成本。史蒂文·格拉泽教授和尼古拉斯·西塔尔教授可以在原型阶段使用这些芯片。该项目正在探索基于mems的传感器在土木和机械工程研究和实践中的许多潜在应用之一。将微机械和电子学直接集成到土木和机械工程师的监测需求中是一种新颖的应用。由于Glaser教授直接参与了由nsf赞助的伯克利传感器和执行器中心（BSAC）和伯克利无线研究中心（BWRC）开发的Macro-Mote的设计和建造，因此有一种特殊的协同作用。具体而言，该项目涉及：从afosr资助的研究项目中获取10个传感器设备；从目前由DARPA赞助的制造运行中获得50个改进型DXL05HR设备；演示了一种大型无线MEMS动态监测系统，该系统具有50个加速度计设备的大型测试结构的密集仪器。

This action is for a Small Grant for Exploratory Research (SGER) to support the acquisition of a state-of-the-art MEMS (Micro-Electro-Mechanical Systems) sensor system, and to integrate it into a real-time natural hazards monitoring system. MEMS is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through the utilization of microfabrication technology. While the electronics are fabricated using integrated circuit (IC) process sequences, the micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.The opportunity exists to buy into a prototype run of MEMS high fidelity digital accelerometers being developed by Integrated Micro Instruments Inc. (IMI), a small start-up company developing MEMS devices under research contracts with DARPA (Defense Advanced Research Projects Agency)and AFOSR (Air Force Office of Scientific Research). This device provides an extremely linear, sensitive, and rugged 3-dimensional accelerometer in a single chip package. Since the output data stream is digitized inside the chip, there are no attendant signal processing issues or costs. Professors Steven Glaser and Nicholas Sitar have access to these chips in the prototype stage.This project is exploring just one of many potential applications of MEMS-based sensors to research and practice in civil and mechanical engineering. It is a novel application to directly integrate the micromechanisms and electronics directly into the monitoring needs of civil and mechanical engineers. There is a special synergy since Professor Glaser is directly involved in the design and construction of the Macro-Mote being developed at the NSF-sponsored Berkeley Sensor and Actuator Center (BSAC), and the Berkeley Wireless Research Center (BWRC).Specifically, this project involves:The acquisition of 10 sensor devices left over from an AFOSR-sponsored research project;The acquisition of 50 improved DXL05HR devices from a fabrication run currently being sponsored by DARPA; Demonstrating a large-scale wireless MEMS dynamic monitoring system with dense instrumentation of large-scale test structures with 50 accelerometer devices.