SGER: High Performance MEMS Metals Developed by Solidification Processing of Composite Coatings and Embedded Layers
SGER: High Performance MEMS Metals Developed by Solidification Processing of Composite Coatings and Embedded Layers
批准号:
0342735
负责人:
Peter Wong
金额:
$9.2万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2003
资助国家:
美国
项目状态:
已结题
起止时间:
2003-08-15 至 2004-07-31
中文摘要
该SGER专注于创新工艺和材料,可以解决(1)由于表面效应引起的可靠性问题,(2)高温后处理,以及(3)多层器件封装。这些材料是高性能的Ni-Al和Ti-Al薄膜,可以涂覆表面或嵌入结构中。在这里,我们建议启动反应,以创建Ni-Al或Ti-Al金属间化合物原位与最小的干预制造工艺/设备。这些材料具有良好的耐腐蚀性,高温强度,并且在Ti-Al的情况下,具有良好的生物相容性,在BioMEMS中具有潜在的应用。 拟议的研究将涉及热建模和实验验证。最大的挑战是优化Ni-Al和Ti-Al沉积厚度以及激光和红外加热参数,以在不损害其余硅结构的情况下触发反应。该团队将采用并使用瞬态熔化/固化模型,该模型最终将扩展到包括反应动力学和原子级沉积的可能性。该SGER将导致开发用于多层和多芯片MEMS器件中的夹层/互连的高性能金属间化合物,利用可添加到标准微制造线的创新,现实的热工艺。此外,还将建立一个先进的金属间化合物凝固过程的热模型。本项目的研究生将受益于两所大学之间强大的跨学科合作,以及为本科课程创建令人兴奋的演示的机会
英文摘要
This SGER focuses on an innovative process and materials that can solve (1) reliability problems due to surface effects, (2) high-temperature post-processing, and (3) packaging in multi-layer devices. The materials are high performance Ni-Al and Ti-Al thin films that can coat surfaces or be embedded in structures. Here we propose to initiate a reaction to create either Ni-Al or Ti-Al intermetallics in-situ with minimal intervention to the fabrication process/equipment. These materials have good corrosion resistance, high temperature strength, and, in the case of Ti-Al, good biocompatibility with potential applications in BioMEMS. The proposed research will involve both thermal modeling and experimental validation. The largest challenge is in optimization of the Ni-Al and Ti-Al deposition thickness and laser and infrared heating parameters to trigger the reaction without harming the rest of the silicon structures. The team will adapt and use a transient melting/solidification model, which will ultimately be expanded to include reaction kinetics and the possibility of atomic level deposition.This SGER will result in the development of high performance intermetallics for interlayer/interconnects in multi-layer and multi-chip MEMS devices, utilizing an innovative, realistic thermal process that can be added to standard microfabrication lines. In addition, an advanced thermal model of intermetallic solidification processing will be created. The graduate students in this project will benefit from strong, interdisciplinary collaboration between two universities, as well as the opportunity to create exciting demonstrations for undergraduate courses
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