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CAREER: Fundamental Research on Silicon Wafer Fine Grinding to Foster a Quantum Leap in Manufacturing of Silicon Wafers

CAREER: Fundamental Research on Silicon Wafer Fine Grinding to Foster a Quantum Leap in Manufacturing of Silicon Wafers
事业:硅片精磨基础研究,促进硅片制造的飞跃
批准号:
0348290
负责人:
Zhijian Pei
金额:
$40.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2004
资助国家:
美国
项目状态:
已结题
起止时间:
2004-02-15 至 2012-01-31

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中文摘要
翻译
该学院早期职业发展(Career)奖支持硅片精细磨削的基础研究,并将研究成果和其他进展整合到工程教育中。该研究的目的是产生对硅晶圆精细研磨的理解和知识,这对于开发创新的晶圆工艺流程是必要的。具体而言,研究将建立数学模型来预测磨削痕迹的距离和轨迹以及卡盘形状对磨削痕迹的影响,并建立物理模型来解释硅片精细磨削中最深次表面裂纹的产生机制和砂轮的自修整机制;并通过实验对模型进行了验证。教育活动包括通过课程、教科书和网络论坛改善制造业教育;通过网站、在线课程和研讨会与工业界接触;让女性/少数族裔学生和K-12教师参与进来。研究结果将使晶圆制造商能够以低成本生产高质量的晶圆。这将导致更便宜和更好的电子产品,这将有利于经济和社会。研究的成功也将对环境产生积极的影响,因为研磨将取代研磨、蚀刻和抛光的主要部分。这将消除或减少使用对环境有害的磨料浆和化学品。这项教育计划将加强堪萨斯州立大学的制造工程项目,促进工业从业者的终身学习,并扩大未被充分代表的群体在研究中的参与。
英文摘要
This Faculty Early Career Development (CAREER) award supports fundamental research on silicon wafer fine grinding, and integration of research results and other advances into engineering education. The objective of the research is to generate the understanding and knowledge of silicon wafer fine grinding necessary for the development of an innovative wafering process flow. Specifically, the research will develop mathematical models to predict the distance and locus of grinding marks and the effects of the chuck shape on grinding marks, and physical models to explain the generation mechanisms of the deepest subsurface cracks and the self-dressing mechanisms of grinding wheels in silicon wafer fine grinding; and validate these models by experiments. The educational activities include improving manufacturing education through curricula, a textbook, and an Internet forum; reaching out to industry through a Web site, online courses, and workshops; and involving women/minority students and K-12 teachers.The results of the research activities will enable wafer manufacturers to produce high quality wafers at low cost. This will result in cheaper and better electronic products, which will benefit the economy and society. Success of the research will also have a positive impact on the environment, because grinding will replace lapping, etching, and a major portion of polishing. This will eliminate or reduce use of environmentally detrimental abrasive slurry and chemicals. The educational initiatives will strengthen the manufacturing engineering program at Kansas State University, promote lifelong learning for industrial practitioners, and broaden participation of the underrepresented groups in research.
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Collaborative Research: IRES Track II: Short Courses on Manufacturing Frontiers Leveraging Unique Facilities in Italy
CAS-Climate: Workshop on Advanced Manufacturing for Industrial Decarbonization; Arlington, Virginia; Summer 2023
FMRG: Eco: CAS-Climate: Sustainable Manufacturing Using Living Organisms and Agriculturally Derived Materials
  • 批准号:
    2229228
  • 项目类别:
    Standard Grant
  • 资助金额:
    $300.0万
  • 财政年份:
    2023
  • 负责人:
    Zhijian Pei
  • 依托单位:
FMRG: Eco: CAS-Climate: Sustainable Manufacturing Using Living Organisms and Agriculturally Derived Materials
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