Collaborative Research: Manufacturing of Mesoscopic 3D Articulated Devices Using Robomold Tooling

本研究的目的是开发一种新的多阶段成型工艺，以创造一种新型的铰接设备，这种设备具有介观特征，对于以具有成本竞争力的方式实现产品的小型化至关重要。将要采用的方法包括几个步骤。首先，对多阶段成型过程中遇到的界面粘附现象进行表征，并建立其与工艺变量的关系。这些知识将用于探索限制界面粘附的替代方法，从而通过轻松分离离散组件而不破坏它们来创建铰接接头。其次，将评估各种型腔形状变化方法和挤出机构的可行性，以实现多级成型的介观关节。这些知识将用于优化制造介观关节装置的工具配置。最后，将进一步了解微尺度电火花加工的工艺参数对表面特性和尺寸精度的影响。这些知识将用于创建用于新成型工艺的模具插入件，这对于定义介观特征尺寸的限制至关重要。拟议的项目预计会产生以下更广泛的影响：首先，对于可以使用新成型工艺制造的介观关节装置，该工艺可以很容易地缩小尺寸并扩大生产数量。因此，这项研究有望为产品的小型化提供新的可能性。其次，新的成型工艺将大大减少装配操作，使制造业的劳动密集程度大大降低。因此，介观设备的制造可以在美国以具有成本竞争力的方式快速轻松地完成。因此，拟议的研究工作将提高美国制造业的竞争力。最后，研究成果将被整合到制造课程中，以教育新一代的工程师，他们准备利用新兴的制造技术创造新产品。

The objective of this research is to develop a novel multi-stage molding process for creating a new class of articulated devices that have mesoscopic features essential to the miniaturization of products in a cost-competitive manner. The approach that will be employed consists of several steps. First, interfacial adhesion phenomena encountered during the multi-stage molding process will be characterized and their relationship to process variables will be established. This knowledge will be utilized to explore alternative ways to limit adhesion at interfaces and hence create articulated joints by easily separating discrete components without breaking them. Second, viability of various cavity shape change methods and ejection mechanisms will be assessed for realizing mesoscopic joints using multi-stage molding. This knowledge will be utilized to optimize tooling configurations for making mesoscopic articulated devices. Finally, an improved understanding of the influence that process parameters for microscale electrical discharge machining have on the resulting surface characteristics and dimensional accuracies will be developed. This knowledge will be utilized to create mold inserts to be used in the new molding process that will be essential to defining the limitations on the size of the mesoscopic features. The proposed project is expected to have the following broader impacts. First, for mesoscopic articulated devices that can be manufactured using the new molding process, the process can be easily scaled down in size and scaled up in production quantity. Hence, this research is expected to enable new possibilities for miniaturizing products. Second, the new molding process will significantly reduce assembly operations and make manufacturing significantly less labor-intensive. Therefore manufacturing of mesoscopic devices can be done quickly and easily inside the US in a cost-competitive manner. Therefore the proposed research effort will enhance the competitiveness of the US manufacturing sector. Finally, the research results will be integrated in the manufacturing curriculum to educate a new generation of engineers ready to exploit emerging manufacturing technologies to create new products.