CRI: IAD Temperature Measurement Infrastructure for Power, Variability, and Reliability Analysis

处理器芯片的功耗和相关的热效应随着每一代技术的发展而恶化。 对处理器芯片的功率和热行为进行建模需要具有挑战性且复杂的验证方法，在某些情况下，这些方法可能不可靠。拟议的基础设施项目开发了一个红外测量设置，允许运行时的功耗的国家的最先进的处理器，以准确地测量在真实的时间。 所提出的红外测量设置具有高空间分辨率（10x10um）和高帧速率（125Hz）能力，以捕获处理器芯片的热图。产生的同步迹线可用于验证现有的和新提出的功率和热模型，并且它们还可用于开发用于下一代处理器芯片设计的新工艺可变性模型。

Power consumption and related thermal effects of processor chips are worstening with each technology generation. Modeling the power and thermal behavior of processor chips requires challenging and complex validation approaches which, in some cases, may be unreliable. The proposed infrastructure project develops an infrared measurement setup that allows run-time power consumption of state-of-the-art processors to be accurately measured in real time. The proposed infrared measurement setup has a high spatial resolution (10x10um) with a high frame rate (125Hz) capacity to capture thermal maps of processor chips. The synchronized traces produced can be used to validate existing and newly proposed power and thermal models, and they can also be used to develop new process variability models for the design of future generation processor chips.