Collaborative Research: 3D Integrated Imaging Receivers for 10-Gb/s Free Space Optical MIMO

这项研究的目标是创造一种新型的节能成像光电接收器，以达到每秒50千兆比特的聚合数据速率，并超过宽带无线光通信。该方法是开发一个大型平面镶嵌光电探测器阵列，其速率为每像素每秒10千兆比特。该阵列包括分集选择电路，其使用光多输入/多输出配置实现。就智能价值而言，该项目解决了光通信中两个众所周知的挑战，信道闪烁和光束对准。该研究探索了与硅集成电路集成的高能效InGaAs金属-半导体-金属光电探测器，用于多功能操作（决策，放大和计算），以及用于大量数据信号处理的多输入/多输出架构的实现。这项研究有望增加对低电压偏压下光电探测器载流子漂移特性和复杂三维光电器件结构物理学的知识体系。本研究还探讨了利用三维晶圆键合技术在硅电路上实现复合半导体器件的异质集成。就更广泛的影响而言，该研究有可能使各种应用受益，包括减少安全漏洞的无线网络，能够在医疗环境中对电磁干扰敏感的设备中传输高分辨率数字图像的网络；大型数据中心的光互连。一个跨大学的课程，涉及信息理论，系统级设计，模拟电路，器件物理，制造和集成的多学科主题。各种各样的项目被用来从代表性不足的群体中招收学生。K-12的外展工作通过塔夫茨工程教育外展中心进行协调。

The objective of this research is to create a new class of power-efficient imaging photoreceivers to reach an aggregated data rate of 50 gigabits per second and beyond for broadband wireless optical communication. The approach is to develop a large array of planar tessellated photodetectors with a rate of 10 gigabits per second per pixel. The array includes diversity selection circuits, which are implemented using an optical multi-input/multi-output configuration.With respect to intellectual merit, this project addresses two well-known challenges in optical wireless communication, channel scintillation and optical beam alignment. The research explores power-efficient InGaAs metal-semiconductor-metal photodetectors that are integrated with silicon integrated circuits for multifunctional operation (decision, amplification, and computing), and the implementation of multi-input/multi-output architectures for signal processing of massive amounts of data. This research is expected to augment the body of knowledge on carrier drift characteristics in the photodetectors at low voltage bias and the physics of complex three-dimensional optoelectronic device structures. This research also explores heterogeneous integration of compound semiconductor device on silicon circuits using three-dimensional wafer bonding for photoreceiver applications.With respect to broader impacts, the research has the potential to benefit a variety of applications, including wireless networks with reduced security vulnerabilities, networks able to transfer high-resolution digital images in the midst of equipment sensitive to electromagnetic interference in healthcare settings; and optical interconnects in large-scale data centers. A cross-university curriculum is addressed, covering multi-disciplinary topics in information theory, system-level design, analog circuits, device physics, fabrication and integration. Various programs are used to recruit students from underrepresented groups. K-12 outreach efforts are coordinated through the Tufts Center for Engineering Educational Outreach.