Lifetime Electrothermal Stress Management for Multi-core Systems

该奖项是根据2009年美国复苏和再投资法案（公法111-5）资助的。本研究的目标是开发一个测量驱动的实时磨损模型，用于测量压力对多核系统剩余寿命的时间累积影响。该方法是开发高效率的内置传感器，用于精确的温度，热梯度和电流测量，并使用实时测量数据，以建立时间依赖的条件概率密度模型，用于应力引起的电路故障和时间历程依赖的系统可靠性。 其智力优势包括设计精确的片上温度和电流传感器的新方法，这些方法显著减少了面积，提高了功率效率，以及实时热梯度表面温度分布的新方法。 其优点还包括引入了基于时间-温度应力历史的条件概率评估的概念，用于开发最佳的功率/热管理方案。更广泛的影响包括消费者通过提高各种高温限制电子系统的寿命和可靠性而获得的好处。 在整个倡议期间，将保持女生和/或少数民族学生对该项目的大量参与。 传感器设计，可靠性增强和统计寿命建模的研究成果将被整合到现有的和新的课程，将提供给校园和远程访问的学生。 研究成果和技术转让的及时传播将通过会议和期刊出版物，网页发布，学生工业实习，以及与美国和国外领先半导体公司的研究人员的密切合作。

This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).The objective of this research is to develop a measurement-driven real-time wear-out model for the time-cumulative effects of electrothermal stress on the remaining life of multi-core systems. The approach is to develop highly efficient built-in sensors for accurate temperature, thermal gradient and current measurements and to use real-time measured data to build time-dependent conditional probability density models for electrothermal stress induced circuit failures and time-history dependent system reliability. The intellectual merits include new methods for designing accurate on-chip temperature and current sensors with significant reductions in area and improvements in power efficiency and new methods for real-time thermal gradient surface temperature profiling. Merits also include introducing the concept of time-temperature stress history based conditional probability assessment for developing optimal power/thermal management schemes. Broader impact includes benefits consumers derive through lifetime and reliability improvements in a broad range of elevated temperature limited electronic systems. Significant participation in this project by female and/or minority students will be maintained throughout this initiative. Research results on sensor design, reliability enhancement and statistical lifetime modeling will be integrated into existing and new courses that will be made available to both on-campus and remote access students. Timely dissemination of research results and technology transfer will be through conference and journal publications, WEB page postings, student industrial internships, and close collaboration with researchers at leading semiconductor companies both in the US and abroad.