Materials World Network: The Materials Computation Center Outreach Effort

伊利诺伊大学厄巴纳-香槟分校的材料计算中心继续进行国际推广工作。其中包括一个国际旅行计划，该计划将年轻科学家送到欧洲参加研讨会、暑期学校和会议，特别是参加由欧洲网络CECAM和Psi-k组织的活动，这些活动涉及广泛应用中的分子和电子模拟主题。这些网络在与材料研究密切相关的科学学科中举办了许多研讨会，如分子和电子模拟、凝聚态物理、材料化学、聚合物、纳米结构和电子材料。参与机构的数量和讲习班的数量都在增长。研讨会的主题每年都在演变，以涵盖计算材料科学的关键当代领域。研讨会为接触新的科学趋势和进行专门培训提供了宝贵的机会。派遣年轻的美国科学家参加这些国际研讨会，以一种直接、富有成效的方式加强了科学伙伴关系。虽然美国在创新技术和高性能计算方面实力雄厚，但欧洲的优势在于对现有方法的应用；欧洲有更多的研究人员开发计算机代码并进行材料模拟。Synergy为两个研究团体增加了价值。此外，MCC建议继续支持美国年度“电子结构中的新方法”研讨会，资助15-20名参加研讨会的初级科学家的旅费，并在伊利诺伊大学主持网站和演示材料。

The Materials Computation Center at the University of Illinois at Urbana-Champaign continues its international outreach efforts. These include an international travel program that sends young scientists to workshops, summer schools and conferences in Europe, and specifically to events organized by the European networks CECAM and Psi-k that are concerned with topics in molecular and electronic simulation over a wide range of applications. Such networks conduct many workshops in scientific disciplines imminently relevant to materials research such as molecular and electronic simulation, condensed matter physics, materials chemistry, polymers, nanostructures, and electronic materials. The number of participating institutions and the number of workshops are both growing. The topics of the workshops evolve yearly to cover key, contemporary areas of computational materials science.The workshops present valuable opportunities for exposure to and specialized training in new scientific trends. Sending young, US-based scientists to these international workshops enhances scientific partnerships in an immediate, productive way. While the US is strong in innovative techniques and high-performance computing, the European strength lies in applications of existing methodology; a larger number of researchers there develop computer codes and perform materials simulations. Synergy adds value to both research communities. In addition, the MCC proposes continuation of support of the annual US "New Methods in Electronic Structure" workshop by funding the travel of 15-20 participating junior scientists and by hosting the website and presentation materials at the University of Illinois.