Collaborative Research: Polymer RF electronics with Co-integrated tuning and thermal cooling using microfluidics

ECCS-1202329/1202431朗达·富兰克林，明尼苏达大学，佐治亚州理工学院合作研究：具有共集成调谐和使用微流体的热冷却的聚合物射频电子产品摘要智能优点：移动通信和雷达系统中的轻型集成射频(RF)前端需要足够的射频功率、调谐能力和低成本。然而，对多功能操作的需求不可避免地增加了电路密度，从而导致更高的产热量。存在与射频电子设备的集成调谐；然而，冷却解决方案是单独开发的，并合并到后端组装后流程中，这会导致成本高昂的更大、更重的系统。为了满足日益增长的移动应用需求，需要具有集成冷却系统的可调射频电子技术平台。然而，它们还没有成功地集成到提供合适高性能的轻质、低成本材料中。明尼苏达大学和佐治亚理工学院的这项合作研究项目寻求开发一种一体化的射频电子和无线通信/雷达系统，具有集成的调谐和冷却设计，使用3-D封装上系统(SOP)方法用于射频前端。可层压的低成本液晶聚合物(LCP)有机基板将首次用于开发用于散热和/或射频调谐的集成微流控通道设计。目标是(1)了解在提供同步冷却的同时在印刷射频电路中用于调谐的介电流体，(2)开发描述具有流体界面的射频设计中的射频和热交互作用的设计/电路模型，以及(3)通过在有机聚合物衬底中创建具有共集成调谐/冷却方法的射频功率放大器电路来证明其可行性。因此，如果没有开发出通过重新配置来最小化或减轻硬件故障并延长硬件寿命的设计方法，则由于频繁的升级，RF电子设备可能会潜在地消耗大量的能量并产生大量的硬件浪费。这项研究的结果可以减缓这种趋势，从而减少废弃电子产品造成的环境废物产生。这项研究将射频电子学与微流控技术相结合，为从事复杂集成系统工作的下一代学生和研究人员提供丰富的培训经验，以保护环境。教育工作将提供射频电子的能源意识，并涉及与亚特兰大和明尼阿波利斯当地的K-12学校建立牢固的联系，积极参与少数族裔学生(即K-12和本科生水平)，与K-12教育工作者合作开发适合年龄的课程/演示，以及介绍讲座/活动，以教育公众关于无线设备的能源使用和消耗。

ECCS-1202329/1202431Rhonda Franklin, University of MinnesotaIoannis Papapolymerou, Georgia Institute of TechnologyCollaborative Research: Polymer RF Electronics with Co-Integrated Tuning and Thermal Cooling Using MicrofluidicsAbstractIntellectual Merit: Lightweight integrated Radio-Frequency (RF) front ends in mobile communications and radar systems require adequate RF power, tuning capability and low cost. Yet, the demand for multi-function operation inevitably increases circuit densities leading to higher heat production. Integrated tuning with RF electronics exists; however, cooling solutions are developed separately and incorporated in a back-end post-assembly process that results in larger heavier systems that are costly. Tunable RF electronic technology platforms with integrated cooling systems are needed to satisfy growing mobile application requirements. However, they have not been successfully integrated into lightweight, low-cost materials that offer suitable high performance. This collaborative research project between the University of Minnesota and the Georgia Institute of Technology seeks to develop an all-in-one RF electronics and wireless communication/radar system with integrated tuning and cooling designs, using a 3-D System-on-a-Package (SOP) approach for RF front-ends. Low cost Liquid Crystal Polymer (LCP) organic substrates that can be laminated will be used to develop for the first time integrated microfluidic channel designs for heat removal and/or RF tuning. The objectives are (1) to understand dielectric fluids use for tuning in printed RF circuits while offering simultaneous cooling, (2) to develop designs/circuit models that describe RF and thermal interactions in RF designs with fluid interfaces, and (3) to demonstrate feasibility by creating an RF power amplifier circuit with co-integrated tuning/cooling approach with a microfluidic systems in organic polymer substrates.Broader Impacts: The 21st century RF mobile electronics market continues to grow at unprecedented rates. Thus, RF electronics can potentially consume enormous amounts of energy and produce significant amounts of hardware waste due to frequent upgrades if design approaches to minimize or alleviate hardware failure and extend hardware lifetimes though reconfiguration are not developed. The outcomes of this research can slow down such trends and therefore reduce environmental waste production caused by disposed electronics. This research combines RF electronics with microfluidics technology to provide a rich training experience for the next generation of students and researchers working on complex integrated systems that can preserve the environment. The educational effort will provide energy awareness from RF electronics and involve developing strong ties with local K-12 schools in Atlanta and Minneapolis, active minority student participation (i.e. K-12 and undergrad level), collaborations with K-12 educators to develop suitable age appropriate curriculum/demonstrations, and presentation talks/events to educate the public on energy use and consumptions in wireless devices.