Investigations into the segregation behavior and line tension of triple lines in tricrystals of copper alloys

提出将联合收割机断层原子探针表征与原子力显微镜相结合，测量铜中合金元素对晶界三重结线的偏聚及其对三重结能的影响。这将通过测量三重接合处的力平衡来实现，所述力平衡由三重接合处的根部处的相邻晶界凹槽的曲率建立。建立了相应的理论基础，并首次对具有随机三结晶体学的纯铜试样进行了测量。这种方法将被用来与断层扫描原子探针分析与定义的三线晶体。预计所获得的信息可以作为纳米级晶界工程的工具。

It is proposed to combine tomographic atom probe characterization and atomic force microscopy to measure the segregation of alloying elements in copper to grain boundary triple junction lines and its effect on triple junction energy. This will be achieved by a measurement of the force equilibrium at a triple junction as established by the curvature of the adjourning grain boundary grooves at the root of the triple junction. A corresponding theoretical basis has been developed and first measurements on specimens of pure copper with random triple junction crystallography have been conducted. This methodology will be utilized in conjunction with tomographic atom probe analysis on tricrystals with defined triple line crystallography. It is expected that the obtained information can serve as a tool for grain boundary engineering at the nanoscale.