Collaborative Research: Surface Engineering and Atomic Layer Deposition of Dielectrics on Two-Dimensional Atomic Crystals for Device Application

该基金由电气、通信和网络系统部（ECCS）的电子、光子学和磁器件（EPMD）项目和材料研究部（DMR）的电子和光子材料（ETM）项目共同资助。小型化是半导体行业技术进步的核心。然而，由于当前的架构和材料正在达到物理定律所施加的限制，因此需要对作为金属氧化物半导体场效应晶体管（MOSFET）的基本构建块的设计进行实质性改变。这个难题的解决方案是使用新材料，例如我们最近才开始详细研究的二维（2D）原子晶体。这种材料是最终的小介质，允许制造高质量的设备。 这项工作的目标是利用和进一步了解这些纳米结构材料的特性，并引入与传统技术不同的操作原理的器件结构，同时继续受益于现有的硅技术的丰富经验。这项工作响应了广泛认识到的需要在纳米电子学和技术的进步，因为目前的范例是达到基本的物理和经济极限。 这项工作的成果还包括新的纳米制造技术和纳米电子计量学，这将增加国家纳米技术组合，这是美国未来技术主导地位的重要组成部分。如果没有高素质的科学家和工程师，技术就不可能得到发展或应用。两名研究生，一名来自UMBC，一名来自乔治梅森大学，将获得博士学位。同时与彼此以及我们在NIST的合作者进行非常密切的互动，为他们在工业界，学术界和政府的职业生涯做好准备。许多本科生也将受益，例如通过做他们的高级设计项目。部分研究将被纳入目前由PI教授的研究生课程，结果将在研讨会，会议和同行评审的出版物中展示。 该提案的目标是在表面制备方法领域产生新的知识，以便在二维（2D）原子晶体MOSFET应用中实现高质量的原子层沉积。二维材料，如隔离单层和几层的MoS2和WSe2将在晶片级生长，用于原位表征和电路集成。它们的表面将经过精心设计，具有自组装的分子单层，以便在纳米粒子的原子层沉积过程中形成高质量的界面。将在沉积过程中原位分析表面处理结果，并与物理吸附的表面处理结果进行比较。这种表面改性将使高性能的2D原子晶体MOSFET和电路仍然与硅技术兼容。这些新器件的特点是更好的栅极控制，更快的操作和更低的泄漏功耗，减少面积和成本。 收购的表面制备技术将实现2D MOSFET和电子电路的集成，并作为展示材料和界面特性的平台。这项工作将利用2D纳米材料和器件的固有优势，有可能对下一代器件和电子电路产生变革性影响。

This grant is funded jointly by the Electronics, Photonics, and Magnetic Devices (EPMD) Program in the Division of Electrical, Communications and Cyber Systems (ECCS) and by the Electronic and Photonic Materials (EPM) Program in the Division of Materials Research (DMR).Miniaturization lies in the heart of technological advancement in the semiconductor industry. However, a substantial change in the design of the basic building block which is the metal oxide semiconductor field effect transistor (MOSFET) is required as the current architecture and materials are reaching limits imposed by the laws of physics. A solution to this conundrum is the use of new materials such as two dimensional (2D) atomic crystals that we have only recently begun to investigate in detail. Such materials are the ultimate small medium allowing the fabrication of high quality devices. The goal of this work is to exploit and further our understanding of the properties of these nanostructured materials and to introduce device structures with operational principles different than the conventional technology, while at the same time continuing to benefit from the already existing vast experience with silicon technology. This work responds to the widely recognized need for progress in nanoelectronics and technology as the current paradigm is reaching the fundamental physical and economic limit. The outcomes of this work also include new nano-fabrication technology and nanoelectronic metrology which will add to the national nanotechnology portfolio, a vital component for the future technological dominance of the USA. Technologies cannot be advanced or applied in the absence of highly qualified scientists and engineers. Two graduate students, one from UMBC and one George Mason University will gain their Ph.D. while interacting very closely with each other and our collaborators at NIST, preparing them for careers in industry, academia and government. Many undergraduate students will also be benefit, for example by doing their senior design projects. Parts of the research will be integrated into graduate level courses currently taught by both PIs and results will be presented in seminars, conferences and peer reviewed publications. The goal of this proposal is to produce new knowledge in the area of surface preparation methods so as to enable atomic layer deposition of high-quality dielectrics on two-dimensional (2D) atomic crystals MOSFET applications. The 2D materials, such as the isolated monolayer and few-layers of MoS2 and WSe2 will be grown at wafer scale for both in-situ characterization and circuit integration. Their surface will be carefully engineered with self-assembled monolayers of molecules to enable the formation of high-quality interface during the atomic layer deposition of dielectrics. The surface preparation results will be analyzed in-situ during the deposition of dielectrics, and compared with physisorbed dielectrics. This surface modification will enable high-performance 2D atomic crystal MOSFETs and circuits which will nevertheless remain compatible with silicon technology. These new devices will be characterized by better gate control, faster operation and lower leakage power dissipation at reduced area and cost. The acquired surface preparation technology will enable integration of 2D MOSFETs and electronic circuits, and act as platforms to demonstrate the properties of materials and interfaces. This work will exploit the inherent advantages of the 2D nanomaterials and devices, with the potential to have transformational impact on the next generation of devices and electronic circuits.