SBIR Phase II: Novel Technologies to Enable High Volume, Extreme Ultraviolet Manufacturing of Integrated Circuits

小型企业创新研究(SBIR)第二阶段项目的更广泛影响/商业潜力是加速下一代计算技术的到来，创造更快、更小、更强大的移动设备，更新摩尔定律设定的预期技术发展速度，并使全球能够访问下一代电子产品。这里开发的技术将使半导体制造中的新的极端紫外线光刻成为可能。这些发展将促进对纳米技术工程商业化和可伸缩性的学习、理解和能力。这个小型企业创新研究(SBIR)第二阶段项目旨在评估新的极端紫外线(EUV)技术的可行性，这些技术能够在14 nm及更小的范围内实现集成电路的大批量制造。目前，资本设备制造商在满足国际半导体技术路线图对集成电路芯片大批量制造的要求方面面临着重大挑战。这对芯片制造商的下一代IC制造和制造设施成本的成功造成了严重的影响。拟议工作的成功成果将代表着在使用EUV资本设备进行大批量制造方面的显著进展。这项拟议工作的智力价值构成了为批量制造而设计的新的最先进的行业架构的基础；这一追求将随后鼓励使用下一代技术的新市场和应用，以克服大批量制造过程中的成本挑战。

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project are to accelerate the arrival of next generation computing technology creating faster, smaller more powerful mobile devices, renewing the expected technological pace of development set by Moore's law, and to enable global access to next generation electronics. The technology developed here will enable new extreme ultraviolet lithography in semiconductor manufacturing. The developments will promote learning, understanding and capability in commercialization and scalability of nanotechnology engineering. This Small Business Innovation Research (SBIR) Phase II project aims to evaluate the feasibility of new extreme ultraviolet (EUV) technologies which enable high volume manufacture of Integrated Circuits at 14nm and smaller. Currently capital equipment manufacturers are facing significant challenges in meeting the International Technology Roadmap for Semiconductors requirements for high volume manufacturing of integrated circuit chips. This has caused severe ramifications to chipmakers on the success of next generation IC manufacturing and fabrication facility costs. Successful results from the work proposed would represent notable progress in high volume manufacturing using EUV capital equipment. The intellectual merit of this proposed work forms the basis of new state of the art industry architecture designed for volume manufacturing; a pursuit that would subsequently encourage new markets and applications using next generation technology overcoming cost challenges in high volume manufacturing processes.