I-Corps: Universal Biaxial Compressive Strain Measurement System

为了提高器件的性能，大多数材料经常受到单轴和双轴应力状态的影响。这些类型的负载下的材料必须得到很好的控制，以实现所需的增益。目前，单轴压缩被认为是实现电子材料应变的最简单方法，并广泛用于制造先进的半导体芯片。然而，与双轴应变相比，单轴应变在剪裁材料性能方面的有效性有限，因此，其未来前景受到限制。双轴应力-应变测试通常难以进行。一些挑战包括：小样本量;基板的夹持完整性;以及基板内的变形均匀性。这项工作的目的是开发一个原型压缩双轴应变室，它可以满足客户谁需要一个可靠的双轴应变测量系统，而不存在上述问题的限制，在目前的系统在市场上。该拟议项目旨在提高半导体行业中使用的电子材料的性能。特别是那些寻求提高器件性能，并希望超越后单轴解决方案以提高效率的人。材料可以分为三个阶段：金属，半导体和绝缘体。尽管预期这些材料将保持其电性质，但当施加压缩应变时，材料的导电性质可被调谐。这种利用应变对电子材料特性的调制被称为应变工程。这个I-Corps团队提出，使用双轴应变系统，不仅可以提高硅基电子器件的性能，还可以提高基于石墨烯和其他二维材料的下一代纳米级电子器件的性能。 在该项目中，该团队将使用双轴测试装置来测量多层二硫化钼和其他2D材料的应变和压力相关的电子，振动，光学和结构特性，高达高应变率（10%）。

To increase device performance, most materials are often subjected to uniaxial and biaxial states of stress. The material under these types of loadings must be well controlled to achieve the desired gain. Currently, uniaxial compression is considered the easiest method for achieving strain in electronic materials, and widely used in manufacturing advanced semiconductor chips. However, uniaxial strain is limited in its effectiveness in tailoring material properties compared to biaxial strain, hence, its future prospects are restricted. Biaxial stress-strain tests are generally difficult to perform. Some of the challenges include: small sample sizes; grip integrity to the substrate; and deformation homogeneity within the substrate. This effort aims to develop a prototype compressive biaxial strain chamber which can cater to customers who need a reliable biaxial strain measurement system without the limitations of the aforementioned issues that exist in current systems in the market. The proposed project is aimed at advancing the performance of electronic materials used in the semiconductor industry. In particular, those who are seeking to increase device performance, and are looking beyond post-uniaxial solutions for increased efficiency. There are three phases that materials can be categorized into are metals, semiconductors, and insulators. Although, it is expected that these materials would maintain their electrical properties, when compressive strain is applied, the material's conductive properties can be tuned. This modulation of the electronic material properties with strain is known as strain engineering. This I-Corps team proposes that using the biaxial strain system, one can increase device performance not only for silicon based electronics, but also for next-generation nanoscale electronics based on graphene and other two-dimensional materials. In this project, the team will use the biaxial testing setup to measure the strain and pressure-dependent electronic, vibrational, optical and structural properties of multilayered molybdenum disulphide and other 2D materials up to high strain rates (10%).