Direct-Write Nanomanufacturing of High Density and High Aspect Ratio Metal Electrode Arrays

该项目旨在开发和应用喷嘴阵列，用于大规模制造高密度和高纵横比的金属电极阵列。 该开发是基于一个电沉积原理，我们最近引入并应用于“直写”各种3-D金属微米和纳米结构在周围环境中，包括高纵横比平面外的金属线，亚微米电互连，弯曲和卷曲的微/纳米结构。 通过扩大制造工艺，这一发展定位于提供一个跨越式的进步，在制造三维微米级和纳米级金属结构的能力与前所未有的尺寸和形状控制，所有在周围环境中，并在一个直接写入的手段。 所开发的工艺将对微电子工业和器件封装工业具有高度吸引力，其中该技术提供了一种全新的制造具有微米级甚至纳米级特征尺寸的3-D高密度电互连的方式，同时显著简化了制造工艺，极大地扩展了设计灵活性，显著减小了尺寸，并最终提供了极大的成本节约。 该项目开发的方法和技术也是学生和公众教育的吸引力主题，并将广泛融入各种教育计划，以有效地培训下一代劳动力，并教育公众科学进步的好处。

The project is aimed to develop and apply a nozzle array for the scale-up fabrication of high density and high aspect ratio metal electrode arrays. The development is based on a meniscus-confined electrodeposition principle that we have recently introduced and applied in "direct writing" a variety of 3-D metal micro and nanostructures in an ambient environment, including high aspect ratio out-of-plane metal wires, submicron electrical interconnects, and curved and coiled micro/nanostructures. By scaling up the manufacturing process, this development is positioned to provide a leap-forward advance in capabilities for manufacturing 3-D microscale and nanoscale metal structures with unprecedented dimensional and shape controls, all in an ambient environment and in a direct-write means. The developed processes will be highly attractive to microelectronics industry and device packaging industry where this technology offers a brand new way of fabricating 3-D high density electrical interconnects with microscale and even nanoscale feature sizes while significantly simplifies the fabrication process, greatly expands the design flexibility, considerably reduces the size and ultimately provides great cost savings. The methods and technologies developed in this project are also appealing subjects for the education of students and the public, and will be broadly integrated into various educational programs to effectively train the next generation work force and educate the public the benefit of scientific advancement.