System integration for optical and wireless Pbit/s communication in high performance computing (A10)

A10项目涉及光学和无线混合收发器的光电封装的开发。为了将毫米波和光模块完全协整到一个封装中，将开发同时使用ic器件嵌入和芯片载波制造的增材制造（AM）方法，并随后制造RF和光互连网络。利用这些方法，阵列无源元件（光耦合器、巴特勒矩阵和天线）将与嵌入式有源集成电路芯片集成，以实现RF-E/ o收发器。

Project A10 deals with the development of an electro-optical packaging of optical and wireless hybrid transceivers. For a complete co-integration of mm-wave and optical modules into a package, additive manufacturing (AM) methods using simultaneous IC-device embedding and chip-carrier fabrication with subsequent fabrication of RF and optical interconnect network will be developed. Using these methods, arrayed passive components (optical couplers, Butler matrices, and antennas) will be integrated with the embedded active IC-chips, in order to realize RF-E/O-transceivers.