Dynamic time-harmonic behaviour of smart patches on hygrothermalpiezoelectric substrates

拟议的研究工作的目的是分析和评估的智能hygrothermalpiezoelectric贴片上的hygrothermalpiezoelectric基板层的时间谐波行为。该分析包括考虑在相应载荷情况下贴片与基底层可能的分层。对于预期的调查的剪切滞后模型将被应用到减少二维弹性方程的控制系统的轴向应力和给定的贴片/基板配置的位移方程的一维动态系统。温度、电位移和湿度的微分方程也将简化为一维方程。此外，还将确定从配置重叠区左侧和右侧产生的分层的界面脱粘长度。另一个目的是通过在固定载荷、材料和几何特征下的电梯度的相应值来识别用于检测界面脱粘长度的可能标准。对于实际应用，模型参数的安全区间以及工作制度的安全区将通过遗传算法（GA）计算。在疲劳破坏本质上是脆性的基础上，提出了考虑智能轻量化结构疲劳寿命的一些出发点。

The aim of the proposed research work is the analysis and assessment of the time-harmonic behaviour of a smart hygropiezothermal patch on a hygrothermalpiezoelectric substrate layer. The analysis includes the consideration of possible delamination of the patch from the substrate layer under respective load cases. For the intended investigation the shear lag model will be applied to reduce the governing system of two-dimensional equations of elasticity to a one-dimensional dynamic system of equations for the axial stresses and displacements of the given patch/substrate configuration. The differential equations for temperature, electric displacement and moisture will be also reduced to one-dimensional equations. Further the interfacial debond length of delaminations emanating from the left and right sides of the overlap zone of the configuration will be determined. A further aim is the identification of a possible criterion for detecting the interface debond length via the respective value of the electric gradient at fixed loading, material and geometric characteristics. For the practical application safety intervals of the model parameters as well as the safety zones of the work regime will be calculated via a genetic algorithm (GA). Some starting point of the consideration on the fatigue life of the smart lightweight structure will be also proposed on the basis that fatigue failure is brittle in nature.