Electrochemical conditions for Separating purified metallic films by electrodeposition at the two-liquid-phase interface.

通过在有机液体和水溶液的界面上阴极还原金属，可以得到二维金属镀层。这种技术的一个优点是不需要任何固体基质。因此，作为该技术的一个有吸引力的应用，本研究对制备纯化金属薄膜的电化学条件进行了研究。首先，研究了保持金属膜沿界面均匀生长的实验技术；通过移动对电极，保持对电极与金属生长前沿之间给定的距离。其次，考察了水溶液中杂质对电沉积锌的生长和纯度的影响。Cu和Fe离子的加入对锌的生长影响不大，Pb离子的加入对锌的生长影响较大。铅和铜在锌中富集，而铁不富集。获得了用该技术制备纯化金属薄膜的基本信息。上述结果对制备高纯度金属薄膜非常有用。

A two-dimensional metal deposit can be obtained by the cathodic reduction of the metal at the interface between an organic liquid and an aqueous solution. One advantage of this technique is that any solid substrate is not needed. Therefore, as one of attractive application of this technique, electrochemical conditions were surveyed for preparing purified metallic films in this study.Firstly, experimental techniques were developed to maintain uniform growth of metallic films along the interface, ; The given distance between the counter electrode and the growth front of the metal was held, by moving the counter electrode.Secondly, effects of impurities in aqueous solutions were examined on the growth and purity of zinc electrodeposited. The additions of Cu and Fe ions influenced scarcely on the growth of zinc,but the addition of Pb ions resulted in an uniform growth of zinc. Pb and Cu enriched in zinc, but Fe did not enrich.Fundamental information to obtain purified metallic films by this technique was obtained.Above results will be very useful for preparing highly purified metallic films.